To prevent interfacial peeling due to the stress of an insulating layer in a capacitor-inductor integrated electronic component having three or more conductor layers. An electronic component includes: a conductor layer M1 including a conductor pattern constituting an inductor; a conductor pattern overlapping a part of the conductor pattern through a dielectric film; an insulating layer covering the conductor layer M1 and conductor pattern; a conductor layer M2 provided on the insulating layer and including a conductor pattern constituting the inductor; and an insulating layer covering the conductor layer M2. The conductor layer M2 is formed to be branching from or independently of the conductor pattern and further includes a dummy pattern overlapping the conductor pattern. This prevents the stress of the insulating layer from being directly applied to the conductor pattern to thereby prevent peeling at the interface between the conductor layer M1 and the dielectric film.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

Aspects of this disclosure relate to bandpass filters with enhanced out of band rejection. The bandpass filters include a stage that is modified using a network of three inductors two of which are mutually coupled inductors. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.

A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.

A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.

An isolation amplification circuit having an input stage circuitry and a control circuitry stage interconnected through a galvanic isolation barrier. The input stage circuitry includes a first filter network and a second filter network for supplying first and second output signals in response to the application of first and second electrical input signals. The input stage circuitry includes a first feedback path configured for applying a first feedback signal to a common node of the first filter network to close a first feedback loop around the first filter network and a second feedback path configured for applying a second feedback signal to a common node of the second filter network to close a second feedback loop around the second filter network.

An isolation amplification circuit having an input stage circuitry and a control circuitry stage interconnected through a galvanic isolation barrier. The input stage circuitry includes a first filter network and a second filter network for supplying first and second output signals in response to the application of first and second electrical input signals. The input stage circuitry includes a first feedback path configured for applying a first feedback signal to a common node of the first filter network to close a first feedback loop around the first filter network and a second feedback path configured for applying a second feedback signal to a common node of the second filter network to close a second feedback loop around the second filter network.

A signal filter includes a notch filter and a wideband filter. The notch filter is configured to perform a band-rejection filtering operation according to a band-rejection filtering property. The wideband filter is coupled to the notch filter, and is configured to perform a wideband filtering operation according to a wideband filtering property. The band-rejection filtering property includes a first cutoff frequency, a frequency bandwidth, a relatively high quality factor and a relatively low coupling coefficient. The wideband filtering property includes a second cutoff frequency, a relatively low quality factor and a relatively high coupling coefficient. The first and the second cutoff frequencies have a frequency difference therebetween. A ratio of the frequency difference to the frequency bandwidth is within a preset ratio range being from 2.5% to 20%.

A signal filter includes a notch filter and a wideband filter. The notch filter is configured to perform a band-rejection filtering operation according to a band-rejection filtering property. The wideband filter is coupled to the notch filter, and is configured to perform a wideband filtering operation according to a wideband filtering property. The band-rejection filtering property includes a first cutoff frequency, a frequency bandwidth, a relatively high quality factor and a relatively low coupling coefficient. The wideband filtering property includes a second cutoff frequency, a relatively low quality factor and a relatively high coupling coefficient. The first and the second cutoff frequencies have a frequency difference therebetween. A ratio of the frequency difference to the frequency bandwidth is within a preset ratio range being from 2.5% to 20%.