Aspects of this disclosure relate to bandpass filters with enhanced out of band rejection. The bandpass filters include a stage that is modified using a network of three inductors two of which are mutually coupled inductors. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.

Aspects of this disclosure relate to bandpass filters with enhanced out of band rejection. The bandpass filters include a stage that is modified using a network of three inductors two of which are mutually coupled inductors. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.

An inductor device, a filter device, and a steering system. The inductor device includes first to third cores and first and second wires. The first core, a portion of the first wire passing through the first core, and a portion of the second wire passing through the first core are provided as a first inductor. The second core and another portion of the first wire passing through the second core are provided as a second inductor. The third core and another portion of the second wire passing through the third core are provided as a third inductor.

An inductor device, a filter device, and a steering system. The inductor device includes first to third cores and first and second wires. The first core, a portion of the first wire passing through the first core, and a portion of the second wire passing through the first core are provided as a first inductor. The second core and another portion of the first wire passing through the second core are provided as a second inductor. The third core and another portion of the second wire passing through the third core are provided as a third inductor.

A band-pass filter includes an unbalanced port, a first balanced port, a second balanced port, and first to third resonators provided between the unbalanced port and the first and second balanced ports. The second resonator and the third resonator each are a resonator with both ends open. The second resonator and the third resonator are adjacent to each other in a circuit configuration, and electromagnetically coupled by magnetic coupling as main coupling. The first resonator is provided closer to the second resonator than to the third resonator, and jump-coupled to the third resonator.

A band-pass filter includes an unbalanced port, a first balanced port, a second balanced port, and first to third resonators provided between the unbalanced port and the first and second balanced ports. The second resonator and the third resonator each are a resonator with both ends open. The second resonator and the third resonator are adjacent to each other in a circuit configuration, and electromagnetically coupled by magnetic coupling as main coupling. The first resonator is provided closer to the second resonator than to the third resonator, and jump-coupled to the third resonator.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.

A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.