According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

An apparatus includes an impedance matching circuit for matching an impedance of a high quality factor (high-Q) antenna to an impedance of a radio-frequency (RF) circuit. The impedance matching network includes a first reactive network. The impedance matching network also includes a second reactive network coupled in series with the first reactive network. The second reactive network includes a reactive component realized by multiple reactive components so as to reduce sensitivity of the impedance matching network to component tolerances in the second reactive network.

A compact millimeter-wave slide screw impedance tuner allows reducing to a minimum the insertion loss between the tuner and the wafer-probe. The structure of the tuner uses a 1 mm slabline and adapters, an eccentrically rotating remotely controlled wideband tuning probe and a sliding rack on which the tuning-probe is attached; the position of the rack is controlled by a permanently anchored motorized pinion. The construction method allows for maximum compactness, needed in order to be able to attach the tuner directly on the wafer-probe and minimize the insertion loss, while maintaining key advantages of electro-mechanical tuners, such as robustness, linearity, simplicity, tuning resolution and calibration and compatibility with existing load pull software and technology.

Automatic impedance matching measures the RF source frequency and RF load voltage, current and phase to determine a single match solution for a capacitive value of the variable capacitor and an inductive value for the variable inductor, and whether a shunt reactance is coupled to the RF source or RF load. Once the capacitance and inductance values for a match solution are determined they are contemporaneously selected without any iterative searching necessary for the match solution.

An apparatus includes an RF apparatus, and a wideband multi-band matching balun. The wideband multi-band matching balun includes a multi-band balun, which includes at least one three-element frequency-dependent resonator (TEFDR). The wideband multi-band matching balun further includes a differential-to-differential matching circuit coupled to the RF apparatus. The differential-to-differential matching circuit includes at least one TEFDR.

According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

A radio-frequency module includes a multilayer substrate, an input switch, an output switch, and filters. A switch IC is disposed on a main surface of the multilayer substrate. The input switch is disposed in the switch IC and includes a first input terminal and first output terminals. The output switch is disposed in the switch IC and includes second input terminals and a second output terminal. The filters are disposed outside the switch IC and are connected to the first output terminals and the second input terminals. In a plan view of the multilayer substrate, the first input terminal and the first output terminals are disposed close to a first side of an exterior of the switch IC, and the second input terminals and the second output terminal are disposed close to a second side different from the first side of the exterior of the switch IC.

A transceiver circuit that includes a receiver and transmitter circuits may send and receive data signals using an antenna. The transceiver circuit may be coupled to the antenna and other circuits using multiple impedance matching networks configured to match input and output impedance values of the receiver and transmitter circuits to the antenna and other circuits. The impedance matching networks may selectively couple and decouple different ports of the receiver and transmitter circuits to other circuit nodes based on whether the transceiver is operating in transmit or receive mode.

A high-frequency module (20) includes a reception-side filter (21) that uses a first frequency band as a pass band and a second frequency band as an attenuation band, an LNA (23), and a matching circuit (22) disposed between the reception-side filter (21) and the LNA (23). In a Smith chart, the matching circuit (22) makes an interval between impedance in the second frequency band of the reception-side filter (21) and a second gain circle center point indicating impedance at which gain in the second frequency band of the LNA (23) is maximized greater than an interval between impedance in the first frequency band of the reception-side filter (21) and a first gain circle center point indicating impedance at which gain in the first frequency band of the LNA (23) is maximized.

An integrated isolator circuit for isolating receiver and transmitter in a Time-Division Duplex transceiver is disclosed. The integrated isolator circuit comprises a first node, a second node and a third node. The integrated isolator circuit further comprises a first capacitor connected in series with a first switch and connected between the first and second nodes. The integrated isolator circuit further comprises a first inductor connected between the first and second nodes and a second capacitor connected between the second node and the third node. The first switch has an on state and an off state, and the integrated isolator circuit is configured to have a different impedance at a certain operating frequency by controlling the state of the first switch.