A radio frequency (RF) integrated circuit may include a die having passive components including at least one pair of capacitors covered by a first dielectric layer supported by the die. The RF integrated circuit may also include an inline pad structure coupled to the at least one pair of capacitors proximate an edge of the die. The inline pad structure may include a first portion and a second portion extending into a dicing street toward the edge of the die and covered by at least a second dielectric layer.

A filter includes a first resonance circuit including a first capacitor and a first inductor connected in parallel between a ground terminal and a first node electrically connected to a first signal terminal not through any capacitor, no inductor being connected in series with the first capacitor between the first node and the ground terminal, a second resonance circuit including a second capacitor and a second inductor connected in parallel between the ground terminal and a second node electrically connected to a second signal terminal not through any capacitor, and a third resonance circuit including a third capacitor and a third inductor connected in parallel between a third node, located in a path through which a high-frequency signal is transmitted between the first and second nodes, and the ground terminal, and a first series inductor connected in series with the third capacitor between the third node and the ground terminal.

RF duplexing and methods of operating the same are described herein. In one embodiment, an RF duplexing system may include a control circuit and a duplexer with a first tunable RF filter and second tunable RF filter. The control circuit is operable in a full duplexing transmission mode and a half duplexing transmission mode. The control circuit tunes the first tunable RF filter in the full duplexing transmission mode so that the first tunable RF filter defines a transmission passband and tune the second tunable RF filter so that the second tunable RF filter defines a receive passband. Also, the control circuit tunes one of the tunable RF filters so that the tunable RF filter defines the passband while the other tunable RF filter enhances the passband. In this manner, the tunable RF filters in the duplexer are both utilized to get better performance during the half duplexing mode.

A high-selectivity low-loss duplexing system includes a first duplexer having a first port, a second port, a transmit port and a receive port. A second duplexer has a third port, a fourth port, an inverted transmit port and the receive port. The first port and the third port are connected to an antenna by a balun. The transmit port and the inverted transmit port are connected to at least one power amplifier. The receive port is connected to a low noise amplifier. A phase shifter includes a lattice filter configured to short the second port to the third port and the fourth port to the first port at a receive frequency, and short the second port to the first port and the fourth port to the third port at a transmit frequency.

A radar transceiver is provided. The radar transceiver includes an electrical balance duplexer that is coupled to a transmission node of a transmission path, a reception node of a reception path, and an antenna node and that is configured to isolate the transmission path from the reception path. The electrical balance duplexer includes a hybrid transformer network and a non-tunable balancing impedance. The non-tunable balancing impedance is configured to provide a fixed impedance value that corresponds to an impedance value at the antenna node.

In a resonant device, a third plane electrode is located between a first plane electrode and a second plane electrode. A first via electrode connects the first plane electrode and the third plane electrode. A second via electrode, a third via electrode, and a fourth via electrode connect the first plane electrode and the second plane electrode. When the third plane electrode is seen in plan view in a normal direction of the first plane electrode, the third plane electrode includes a first projecting portion overlapping with a first area between the second via electrode and the third via electrode, and a second projecting portion overlapping with a second area between the third via electrode and the fourth via electrode.

An electronic component a multilayer body including insulation layers stacked in a stacking direction, a mounting surface that opposes a circuit board when the electronic component is mounted on the circuit board, first and second input/output terminals provided on the mounting surface and adjacent to each other, a ground terminal, a first filter circuit, in the multilayer body, electrically connected between the first input/output terminal and the second input/output terminal, and a ground conductor layer, provided between the first filter circuit and the mounting surface in the stacking direction, that overlaps with the first input/output terminal and the second input/output terminal when viewed in plan view from the stacking direction, and that is connected to the ground terminal.

The present disclosure provides circuits and methods for fabricating circuits. A circuit may include an insulator having a first surface, a second surface, a periphery, a first subset of circuit elements disposed on the first surface, a second subset of circuit elements disposed on the second surface, and at least one conductive sidewall disposed on the periphery, wherein the conductive sidewall electrically couples the first subset of circuit elements to the second subset of circuit elements.

Embodiments disclosed herein relate to isolating a receiver circuit of an electronic device from a transmission signal and leakage of the transmission signal. To do so, an isolation circuit is disposed between the receiver circuit and a transmission circuit. The isolation circuit may include multiple variable impedance devices and one or more antennas. The impedances of the variable impedance devices may be balanced such that a signal at a particular frequency or within a particular frequency band can pass through or is blocked by the isolation circuit. The isolation circuit may include one or more double balanced duplexers to achieve the improved isolation. The isolation circuit may also increase bandwidth available for wireless communications of the electronic device.

A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.