In a described example, an apparatus includes: a semiconductor die with a component on a device side surface; a die seal surrounding the component on the device side surface; a package substrate having bond pads on a die side surface; a package substrate seal formed on the die side surface of the package substrate corresponding to the die seal on the semiconductor die; the semiconductor die flip chip mounted on the bond pads of the package substrate with solder joints connecting post connects on the semiconductor die to the bond pads of the package substrate; a mold compound seal formed by the die seal and the package substrate seal; and mold compound covering a portion of the semiconductor die, a portion of the die side of the package substrate, and contacting the mold compound seal, the mold compound spaced from the component.

A circuit includes a semiconductor substrate and an integrated passive device. The integrated passive device is on a surface of the semiconductor substrate. The integrated passive device is in a metal layer on the semiconductor substrate. The metal layer is at least tens of micrometers thick. The integrated passive device may be an inductor or a capacitor in some examples.

An acoustic wave device includes a support substrate, a low-acoustic-velocity film on the support substrate, a piezoelectric layer on the low-acoustic-velocity film, an IDT electrode on the piezoelectric layer, and a high-acoustic-velocity film between the support substrate and the low-acoustic-velocity film. An acoustic velocity of a bulk wave propagating through the low-acoustic-velocity film is lower than an acoustic velocity of a bulk wave propagating through the piezoelectric layer. An acoustic velocity of a bulk wave propagating though the high-acoustic-velocity film is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric layer. Adhesion between the low-acoustic-velocity film and the support substrate is higher than adhesion between the high-acoustic-velocity film and the support substrate. The high-acoustic-velocity film is between portions of the support substrate and the low-acoustic-velocity film, and a portion of the low-acoustic-velocity film and a portion of the support substrate contact each other.

A thin-film bulk acoustic resonator (FBAR) apparatus includes a lower dielectric layer including a first cavity; an upper dielectric layer including a second cavity, wherein the upper dielectric layer is on the lower dielectric layer; and an acoustic resonance film that is positioned between and separating the first and the second cavities. The acoustic resonance film includes a lower electrode layer, an upper electrode layer, and a piezoelectric film that is sandwiched between the lower and upper electrode layers. A plan view of the first and the second cavities overlap to form an overlapped region having a polygonal shape without parallel sides.

An electronic filter comprises a high pass section (110) and a low pass section (120). The high pass section includes at least one filter stage of a series-connected acoustic resonator (111) and a parallel connected inductor (114). The low pass section comprises at least one filter stage including a series-connected inductor (121) and a parallel connected acoustic resonator (123). The filter is useful for a communication device covering the n79 5G band.

An acoustic wave device includes a piezoelectric layer made of lithium niobate or lithium tantalate and including a first main surface, and an IDT electrode and a first dielectric film on the first main surface. A ratio d/p is equal to or less than about 0.5, when a thickness of the piezoelectric layer is d and a center-to-center distance between adjacent electrodes is p. The first dielectric film includes first and second surfaces facing each other. The second surface is a surface on a side of the piezoelectric layer. The IDT electrode includes third and fourth surfaces facing each other. The fourth surfaces are on the side of the piezoelectric layer. The first surface of the first dielectric film is at a same height as or higher than the third surfaces of the IDT electrode. A second dielectric film is on the first surface of the first dielectric film.

Aspects of this disclosure relate to a multiplexer with a hybrid acoustic passive filter. The multiplexer includes a plurality of filters configured to filter respective radio frequency signals, a shared filter coupled between each of the plurality of filters and a common node, and a radio frequency filter coupled to the common node. At least a first filter of the plurality of filters includes acoustic resonators and a non-acoustic passive component. Related multiplexers, wireless communication devices, and methods are disclosed.

A filter module has a first terminal, a second terminal, and at least one filter disposed along each signal path extending from the first terminal to the second terminal. The filter can include a plurality of series resonators and a plurality of shunt resonators disposed between the series resonators and a ground configured to enhance power ruggedness of the filter module. A matching circuit coupled to the filter performs impedance matching of the filter.

An acoustic resonator device and method thereof. The device includes a substrate member having an air cavity region. A piezoelectric layer is coupled to and configured overlying the substrate member and the air cavity region. The piezoelectric layer is configured to be characterized by an x-ray rocking curve Full Width at Half Maximum (FWHM) ranging from 0 degrees to 2 degrees. A top electrode is coupled to and configured overlying the piezoelectric layer, while a bottom electrode coupled to and configured underlying the piezoelectric layer within the air cavity region. The configuration of the materials of the piezoelectric layer and the substrate member to achieve the specific FWHM range improves a power handling capability characteristic and a power durability characteristic.

Devices and systems useful in concurrently receiving and transmitting Wi-Fi signals and Bluetooth signals in the same frequency band are provided. By way of example, an electronic device includes a transceiver configured to transmit data and to receive data over channels of a first wireless network and a second wireless network concurrently. The transceiver includes a plurality of filters configured to allow the transceiver to transmit the data and to receive the data in the same frequency band by reducing interference between signals of the first wireless network and the second wireless network.