In an embodiment, a tunable stiffness mechanical filter is provided including an input coupler to a negative stiffness structure with a negative stiffness characteristic, and further including a tuner for tuning the negative stiffness structure. An output sensor is located along the negative stiffness structure. The filter may include an amplifier and/or a driver coupled between the output sensor and the negative stiffness structure.

The specification relates to an RF filter in which characteristic filter variables have a decreased dependency on tuning. A filter in this case comprises series-interconnected basic elements that each have an electroacoustic resonator and impedance converters interconnected in series between the basic elements.

Techniques for improving Bulk Acoustic Wave (BAW) reflector and resonator structures are disclosed, including filters, oscillators and systems that may include such devices. A bulk acoustic wave (BAW) resonator may comprise a substrate and a first layer of piezoelectric material having a first piezoelectric axis orientation. The bulk acoustic wave (BAW) resonator may comprise a multi-layer acoustic reflector, e.g., a multi-layer metal top acoustic reflector electrode, including a first pair of top metal electrode layers. The first pair of top metal electrode layers may be electrically and acoustically coupled with the first layer of piezoelectric material to excite a piezoelectrically excitable resonance mode at a resonant frequency of the BAW resonator.

An electromechanical device includes a piezoelectric support delimited by a surface, or by two surfaces parallel to each other, and, on this support, a resonator for elastic waves propagating parallel to the surface or surfaces, the resonator including two reflectors that delimit the resonator and which are reflective for the waves, several interfacing transducers, to generate the waves from an electrical signal, and several transducers for controlling the resonance frequency, each transducer including a first electrode and a second electrode that are interdigitated, the transducers being arranged along the propagation path followed by the waves in the resonator, with, along the path, an alternation between interfacing transducer and tuning transducer.

Techniques for improving acoustic wave device structures are disclosed, including filters and systems that may include such devices. An apparatus may comprise a first electrical filter including an acoustic wave device. The first electrical may having a first filter band in a Super High Frequency (SHF) band or an Extremely High Frequency (EHF) band to facilitate compliance with a regulatory requirement or a standards setting organization specification. For example, the first electrical filter may comprise a notch filter having a notch band overlapping at least a portion of an Earth Exploration Satellite Service (EESS) band to facilitate compliance with a regulatory requirement or the standards setting organization specification for the Earth Exploration Satellite Service (EESS) band.

One example includes an acoustic resonator filter system. The system includes a plurality of filter blocks. Each of the filter blocks can include a plurality of tunable filter elements. Each of the tunable filter elements can include an acoustic resonator. The system also includes a switching network that receives a radio frequency (RF) input signal and provides a filtered RF output signal. The switching network can be configured to selectively switch at least one of the filter blocks in a signal path of the RF input signal to provide the RF output signal.

Disclosed is a gallium arsenide (GaAs) enabled tunable filter for, e.g., 6 GHz Wi-Fi RF Frontend, with integrated high-performance varactors, metal-insulator-metal (MIM) capacitors, and 3D solenoid inductors. The tunable filter comprises a hyper-abrupt variable capacitor (varactor) high capacitance tuning ratio. The tunable filter also comprises a GaAs substrate in which through-GaAs-vias (TGV) are formed. The varactor along with the MIM capacitors and the 3D inductors is formed in an upper conductive structure on upper surface of the GaAs substrate. Lower conductive structure comprising lower conductors is formed on lower surface of the GaAs substrate. Electrical coupling between the lower and upper conductive structures is provided by the TGVs. The tunable filter can be integrated with radio frequency front end (RFFE) devices.

Techniques for improving Bulk Acoustic Wave (BAW) resonator structures are disclosed, including fluidic systems, oscillators and systems that may include such devices. A bulk acoustic wave (BAW) resonator may comprise a substrate and a first layer of piezoelectric material. The bulk acoustic wave (BAW) resonator may comprise a top electrode. A sensing region may be acoustically coupled with the top electrode of the bulk acoustic wave (BAW) resonator.

A voltage sensor device includes an oscillator unit, the oscillator unit having a tunable bulk acoustic wave (BAW) resonator device and an oscillator core. The voltage sensor device also includes a frequency analyzer configured to obtain frequency measurements for the oscillator unit and to determine a voltage sense value based on a comparison of at least some of the obtained frequency measurements. The voltage sensor device also includes an output interface configured to store or output voltage sense values determined by the frequency analyzer.

Techniques for improving Bulk Acoustic Wave (BAW) resonator structures are disclosed, including filters, oscillators and systems that may include such devices. First and second layers of piezoelectric material may be acoustically coupled with one another to have a piezoelectrically excitable resonance mode. The first layer of piezoelectric material may have a first piezoelectric axis orientation, and the second layer of piezoelectric material may have a second piezoelectric axis orientation that opposes the first piezoelectric axis orientation of the first layer of piezoelectric material. A top acoustic reflector including a first pair of top metal electrode layers may be electrically and acoustically coupled with the first layer of piezoelectric material to excite the piezoelectrically excitable main resonance mode at a resonant frequency.