Disclosed is a piezoelectric oscillating device, which comprises a multi-section guiding component and an oscillation generating component, the multi-section guiding component including a plurality of guiding units, each guiding unit having a hollow space, the plurality of guiding units being connected together along a longitudinal direction in such a manner that the hollow spaces are connected in series to form the multi-section guiding component, and a guiding channel is formed inside the multi-section guiding component by connecting the plurality of hollow spaces in series, the oscillation generating component including a housing unit and a piezoelectric component, the housing unit being connected to an end of the multi-section guiding component in the longitudinal direction, the piezoelectric component being disposed in a disposing space in the housing unit and oscillating via a control of a piezoelectric signal.

Disclosed is a piezoelectric oscillating device, which comprises a multi-section guiding component and an oscillation generating component, the multi-section guiding component including a plurality of guiding units, each guiding unit having a hollow space, the plurality of guiding units being connected together along a longitudinal direction in such a manner that the hollow spaces are connected in series to form the multi-section guiding component, and a guiding channel is formed inside the multi-section guiding component by connecting the plurality of hollow spaces in series, the oscillation generating component including a housing unit and a piezoelectric component, the housing unit being connected to an end of the multi-section guiding component in the longitudinal direction, the piezoelectric component being disposed in a disposing space in the housing unit and oscillating via a control of a piezoelectric signal.

A high-frequency apparatus includes a resin substrate, a first device including a substrate and provided on the resin substrate, and a second device provided adjacent to the first device on the resin substrate. Each of the first device and the second device includes an acoustic wave device. The second device includes a piezoelectric substrate and a functional element provided on the piezoelectric substrate. The substrate of the first device includes Si or a laminated material including Si. The piezoelectric substrate of the second device includes LiTaO.sub.3, LiNbO.sub.3, or a laminated material including LiTaO.sub.3 or LiNbO.sub.3. The resin substrate includes glass.

A high-frequency apparatus includes a resin substrate, a first device including a substrate and provided on the resin substrate, and a second device provided adjacent to the first device on the resin substrate. Each of the first device and the second device includes an acoustic wave device. The second device includes a piezoelectric substrate and a functional element provided on the piezoelectric substrate. The substrate of the first device includes Si or a laminated material including Si. The piezoelectric substrate of the second device includes LiTaO.sub.3, LiNbO.sub.3, or a laminated material including LiTaO.sub.3 or LiNbO.sub.3. The resin substrate includes glass.

Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.

Acoustic resonators are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces. The back surface is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT includes: a first busbar and a second busbar disposed on respective portions of the piezoelectric plate other than the diaphragm; a first set of elongate fingers extending from the first bus bar onto the diaphragm; and a second set of elongate fingers extending from the second bus bar onto the diaphragm, the second set of elongate fingers interleaved with the first set of elongate fingers.

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

Aspects of the subject technology relate to electronic devices having microphones. An electronic device may include a microphone and a resonator for the microphone. The resonator may be formed in a device structure that is spatially separated from the microphone. The resonator may be formed in an interior wall of a housing of the electronic device, or in a support structure within an enclosure of the electronic device. A resonator and/or one or more damping features, may reduce a resonance effect, on the microphone, of a resonant cavity within the enclosure of the electronic device and adjacent the microphone.

Aspects of the subject technology relate to electronic devices having microphones. An electronic device may include a microphone and a resonator for the microphone. The resonator may be formed in a device structure that is spatially separated from the microphone. The resonator may be formed in an interior wall of a housing of the electronic device, or in a support structure within an enclosure of the electronic device. A resonator and/or one or more damping features, may reduce a resonance effect, on the microphone, of a resonant cavity within the enclosure of the electronic device and adjacent the microphone.