An array substrate is disclosed. The array substrate may include a base substrate (21), a pixel defining layer (22) on the base substrate (21), and a charge generating layer (24) above the pixel defining layer (22). The pixel defining layer (22) may define a plurality of pixel regions. The pixel defining layer (22) may include a plurality of acoustic structures (220), and each of the plurality of acoustic structures (220) may be configured to resonate under an action of an acoustic wave of a threshold frequency to form a slit to disconnect the charge generating layer (24) of two adjacent pixel regions of the plurality of pixel regions.

The invention relates to a piezoelectric resonator, which comprises a base and at least two vibrating arms (3) extending from the base, at least two grooves (4a, 4b) being formed opposite each other on part of the length of the arms and on upper and lower faces of the arms. The depth of the groove on the upper face is less than 30% of the total thickness of each arm and the depth of the groove on the lower face is more than 50% of the total thickness of each arm, or reversely.

The invention relates to a piezoelectric resonator, which comprises a base and at least two vibrating arms (3) extending from the base, at least two grooves (4a, 4b) being formed opposite each other on part of the length of the arms and on upper and lower faces of the arms. The depth of the groove on the upper face is less than 30% of the total thickness of each arm and the depth of the groove on the lower face is more than 50% of the total thickness of each arm, or reversely.

A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

A vibration element includes a base and a vibrating arm extending from the base. The vibrating arm includes an arm positioned between the base and a weight. A weight film is disposed on the weight. The weight has a first principal surface and a second principal surface in a front and back relationship with respect to a center plane of the arm. A center of gravity of the weight is located between the first principal surface and the center plane of the arm. A center of gravity of the weight film is located between the second principal surface and the center plane of the arm.

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

An object is to provide a frequency adjustment method for a piezoelectric resonator device that is applicable to a microminiaturized device and that can adjust the frequency without deteriorating the accuracy of frequency adjustment. A frequency adjustment method for a tuning-fork quartz resonator is applicable to a tuning-fork quartz resonator that includes a tuning-fork quartz resonator piece having a pair of resonator arms 31, 32 and metallic adjustment films W formed on the resonator arms. The frequency adjustment method adjusts the frequency by reduction of a mass of the metallic adjustment films W. The frequency adjustment method includes: a rough adjustment step for roughly adjusting the frequency by partially thinning or removing the metallic adjustment films W; and a fine adjustment step for finely adjusting the frequency by at least partially thinning or removing products W1, W2 derived from the metallic adjustment film W during the rough adjustment step.

A vibrator device includes a vibrating body having a first surface, a package having a second surface opposed to the first surface of the vibrating body, a circuit board provided to the package so as to be opposed to the first surface of the vibrating body, a plurality of coupling electrodes provided to the first surface of the vibrating body, a first coupling line provided to the second surface of the package, a second coupling line provided to the circuit board, and a bonding material electrically coupling the coupling electrode and the first coupling line to each other, wherein the vibrating body has a protrusion protruding toward the package farther than the coupling electrode at the first surface side, and the protrusion has contact with the second surface of the package.

A vibrator device includes a vibrating body having a first surface, a package having a second surface opposed to the first surface of the vibrating body, a circuit board provided to the package so as to be opposed to the first surface of the vibrating body, a plurality of coupling electrodes provided to the first surface of the vibrating body, a first coupling line provided to the second surface of the package, a second coupling line provided to the circuit board, and a bonding material electrically coupling the coupling electrode and the first coupling line to each other, wherein the vibrating body has a protrusion protruding toward the package farther than the coupling electrode at the first surface side, and the protrusion has contact with the second surface of the package.