An acoustic wave filter device includes at least one series arm resonator and a parallel arm resonator. The series arm resonators and the parallel arm resonator are defined by acoustic wave resonators, an interdigital transducer electrode of the series arm resonators is an apodized interdigital transducer electrode subjected to apodization weighting, in the interdigital transducer electrode of the parallel arm resonator, an intersecting portion includes a central region and low acoustic velocity regions provided at both outer side portions of the central portion, an acoustic velocity of an acoustic wave in the low acoustic velocity region is lower than an acoustic velocity of an acoustic wave in the central region, and a high acoustic velocity region where an acoustic velocity of an acoustic wave is higher than that of the low acoustic velocity region is provided at an outer side portion of each of the low acoustic velocity regions.

An acoustic wave filter device includes at least one series arm resonator and a parallel arm resonator. The series arm resonators and the parallel arm resonator are defined by acoustic wave resonators, an interdigital transducer electrode of the series arm resonators is an apodized interdigital transducer electrode subjected to apodization weighting, in the interdigital transducer electrode of the parallel arm resonator, an intersecting portion includes a central region and low acoustic velocity regions provided at both outer side portions of the central portion, an acoustic velocity of an acoustic wave in the low acoustic velocity region is lower than an acoustic velocity of an acoustic wave in the central region, and a high acoustic velocity region where an acoustic velocity of an acoustic wave is higher than that of the low acoustic velocity region is provided at an outer side portion of each of the low acoustic velocity regions.

A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.

The present disclosure relates to an electronic device for radiating an output signal in a wireless communication system. In one embodiment, the electronic device includes: a power amplifier configure to receive an input signal; a splitter connected to the power amplifier, which a plurality of branches; a plurality of filters connected to the plurality of branches of the splitter; and a plurality of antenna elements connected to the plurality of filters. The plurality of antenna elements radiates the output signal that is a portion of the input signal received by the power amplifier.

RF filtering circuitry comprises a first node, a second node, and a series signal path between the first node and the second node. A number of acoustic resonators are coupled to one or more of the first node and the second node via the series signal path. A first one of the acoustic resonators is associated with a first quality factor and a first electromechanical coupling coefficient. A second one of the acoustic resonators is associated with a second quality factor and a second electromechanical coupling coefficient. The first quality factor is different from the second quality factor and the first electromechanical coupling coefficient is different from the second electromechanical coupling coefficient.

An apparatus is disclosed for harmonic reduction with filtering. In example aspects, the apparatus includes a filter circuit with first and second filter ports, first and second lattice filters, and first and second signal manipulator circuits. The first signal manipulator circuit includes a first port, a second port, and a third port coupled to the first filter port. The first signal manipulator circuit splits an input signal into multiple split signals, shifts a phase thereof to produce at least one phase-shifted split signal, and provides the phase-shifted split signal to the first and second ports. The first lattice filter is coupled to the first port, and the second lattice filter is coupled to the second port. The second signal manipulator circuit includes a first port coupled to the first lattice filter, a second port coupled to the second lattice filter, and a third port coupled to the second filter port.

An apparatus is disclosed for harmonic reduction with filtering. In example aspects, the apparatus includes a filter circuit with first and second filter ports, first and second lattice filters, and first and second signal manipulator circuits. The first signal manipulator circuit includes a first port, a second port, and a third port coupled to the first filter port. The first signal manipulator circuit splits an input signal into multiple split signals, shifts a phase thereof to produce at least one phase-shifted split signal, and provides the phase-shifted split signal to the first and second ports. The first lattice filter is coupled to the first port, and the second lattice filter is coupled to the second port. The second signal manipulator circuit includes a first port coupled to the first lattice filter, a second port coupled to the second lattice filter, and a third port coupled to the second filter port.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

Various embodiments of an interconnect device and modules and systems that utilize such interconnect device are disclosed. In one or more embodiments, the interconnect device can include a printed circuit board (PCB). The PCB can include a substrate forming a resiliently deflectable element, a conductive material disposed on the substrate, and an electrical contact disposed on the resiliently deflectable element and electrically coupled to the conductive material. The interconnect device can also include a connector that includes a connecting pin configured to electrically couple with the electrical contact of the resiliently deflectable element of the PCB and cause the resiliently deflectable element to deflect when the element contacts the connecting pin.

An acoustic device includes a foundation structure and a transducer provided over the foundation structure. The foundation structure includes a piezoelectric layer between a top electrode and a bottom electrode. The piezoelectric layer has an active portion within an active region of the transducer, and a bi-polar border portion within a border region of the transducer. The piezoelectric material in the active portion has a first polarization. The bi-polar border portion has a first sub-portion and a second sub-portion, which resides either above or below the first sub-portion. The piezoelectric material in the first sub-portion has the first polarization, and the piezoelectric material in the second sub-portion has a second polarization, which is opposite the first polarization.