Patent classifications
H03K19/00315
OVERDRIVE ELECTROSTATIC DISCHARGE CLAMP
An electrostatic discharge clamp is shown, which includes a clamping circuit, a driving circuit, a capacitor and resistor network, and a bias circuit. The clamping circuit has a plurality of transistors connected in a cascode configuration. The driving circuit is coupled to the gates of the transistors of the clamping circuit. The capacitor and resistor network introduces an RC delay in response to an electrostatic discharge event to control the driving circuit to turn on the transistors of the clamping circuit for electrostatic discharging. The bias circuit biases the driving circuit to turn off the transistors of the clamping circuit when the capacitor and resistor network does not detect the electrostatic discharge event.
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
A Schmitt trigger circuit includes a first and second set of transistors, a first and second feedback transistor, and a first and second circuit. The first set of transistors is connected between a first voltage supply and an output node. The first voltage supply has a first voltage. The second set of transistors is connected between the output node and a second voltage supply. The second voltage supply has a second voltage. The first feedback transistor is connected to the output node, a first node and a second node. The second feedback transistor is connected to the output node, a third node and a fourth node. The first circuit is coupled to and configured to supply the second supply voltage to the second node. The second circuit is coupled to and configured to supply the first supply voltage to the fourth node.
HIGH-SPEED VOLTAGE CLAMP FOR UNTERMINATED TRANSMISSION LINES
A high-speed voltage clamping circuit includes p-type field effect transistor (PFET) biasing circuit, an n-type field effect transistor (NFET) biasing circuit, and a field effect transistor (FET) clamp circuit. The PFET biasing circuit is configured to generate a PFET biasing voltage. The NFET biasing circuit is configured to generate a NFET biasing voltage. The FET clamp circuit is in signal communication with the PFET biasing circuit and the NFET biasing circuit. The PFET biasing circuit controls operation of the clamping circuit in response to a voltage overshoot event and the NFET biasing circuit controls operation of the clamping circuit in response to a voltage undershoot event.
POST DRIVER AND CHIP WITH OVERDRIVE CAPABILITY
A post driver and a chip with overdrive capability are shown. A first bias circuit is configured to provide a first voltage shift between the output terminal of the post driver and the gate terminal of the first p-channel metal-oxide-semiconductor (PMOS) transistor of a pull-up circuit when the pull-down circuit is enabled. A second bias circuit is configured to provide a second voltage shift between the output terminal of the post driver and the gate terminal of the first n-channel metal-oxide-semiconductor (NMOS) transistor of the pull-down circuit when the pull-up circuit is enabled. Accordingly, the PMOS transistors in the pull-up circuit and the NMOS transistors in the pull-down circuit are all well protected although they are powered by an overdrive voltage.
LEVEL SHIFTER AND CHIP WITH OVERDRIVE CAPABILITY
A level shifter and a chip with the level shifter are shown. Between the input pair and the cross-coupled output pair, there are a first protection circuit and a second protection circuit. An overdrive voltage, which is double the nominal voltage of the level shifter plus a delta voltage, is applied to the level shifter. The first protection circuit has a first voltage-drop circuit that compensates for the delta voltage. The second protection circuit has a second voltage-drop circuit that compensates for the delta voltage.
Dynamic gate-overdrive voltage boost receiver
In certain aspects, a receiving circuit includes a splitter, a first receiver, a second receiver, and a boost circuit. The splitter is configured to receive an input signal, split the input signal into a first signal and a second signal, output the first signal to the first receiver, and output the second signal to the second receiver. In certain aspects, the voltage swing of the input signal is split between the first signal and the second signal. The boost circuit may be configured to shift a supply voltage of the second receiver to boost a gate-overdrive voltage of a transistor in the second receiver during a transition of the input signal (e.g., transition from low to high). In certain aspects, the boost circuit controls the gate-overdrive voltage boosting based on the first signal and the second signal.
LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE
To reduce a leakage current of a transistor so that malfunction of a logic circuit can be suppressed. The logic circuit includes a transistor which includes an oxide semiconductor layer having a function of a channel formation layer and in which an off current is 1×10.sup.−13 A or less per micrometer in channel width. A first signal, a second signal, and a third signal that is a clock signal are input as input signals. A fourth signal and a fifth signal whose voltage states are set in accordance with the first to third signals which have been input are output as output signals.
CHARGING PROTECTION CIRCUIT, CHARGING CIRCUIT, AND ELECTRONIC DEVICE
This application relates to a charging protection circuit. The charging protection circuit implements overcurrent protection by using a four-terminal NMOS switching transistor. In the solution provided in this application, floating management is performed on a Sub port of the four-terminal NMOS switching transistor. Specifically, when the four-terminal NMOS switching transistor is turned on, potential of the Sub port is pulled up, to avoid an excessively large internal resistance of the four-terminal NMOS switching transistor caused by an excessively large voltage between the Sub port and a drain of the four-terminal NMOS switching transistor. In addition, this application further provides a charging circuit and an electronic device.
Latchup immune microcontroller system
A latchup immune microcontroller system with a power supply and a filter designed to eliminate external risks of triggering a latchup of a microcontroller caused by the power supply; a clock circuit with a clock frequency and a layout for eliminating external risks of triggering a latchup of the microcontroller caused by a high-frequency clock signal; a reset circuit that uses an optical triggering mechanism acting as a common power supply and an isolated power supply, the power detection circuit and a discharge circuit react in chain in time, avoid risks of triggering latchups of the microcontroller caused by reset signals; an interrupt with a high priority level and the discharge circuit react in chain in time to enhance data security, and output terminals are turned off in sequence to remove external causes of latchup. An application method of an I/O port to eliminate triggers of latchup of the microcontroller.
CHIP WITH PAD TRACKING
A chip with pad tracking having an input/output buffer (I/O buffer), a pad, and a bias circuit. The I/O buffer is powered by a first power and is coupled to the pad. The pad is coupled to the system power. The bias circuit generates a bias signal to be transferred to the I/O buffer to block a leakage path within the I/O buffer when the system power is on and the first power is off. The bias circuit is a voltage divider which generates a divided voltage as the bias signal. In an example, the bias circuit is powered by a second power that is independent from the first power and is not drawn from the pad. In another example, a power terminal of the bias circuit is coupled to an electrostatic discharging bus, and the pad is coupled to the electrostatic discharging bus through a diode.