H03K19/00323

REDUCING TIMING SKEW IN A CIRCUIT PATH
20190069394 · 2019-02-28 ·

An example method performed for a circuit path includes: receiving signals in the circuit path; and controlling states of the signals in the circuit path based on skews produced by circuits electrically connected in series in the circuit path. The states are controlled by inverting or not inverting the signals in the circuit path so that skews produced by different circuits in the circuit paths at least partially cancel.

APPARATUSES AND METHODS FOR PARTIAL BIT DE-EMPHASIS
20190013809 · 2019-01-10 · ·

Apparatuses and methods for partial bit de-emphasis are provided. An example apparatus includes an output driver and control circuit. The output driver includes a pull-up circuit including one or more pull-up legs, and a pull-down circuit including one or more pull-down legs. The control circuit may be coupled to the output driver and configured to receive an input signal having a first logical value and a second logical value, and in response to determining the logical transition has occurred from the second logic value to the first logic value, cause the pull-up circuit and pull-down circuit respectively to enter a first state for a duration of a first portion of a bit period and to enter a second state for a duration of a second portion of the bit period preceding the first portion.

DYNAMIC VOLTAGE-LEVEL CLOCK TUNING
20190004583 · 2019-01-03 ·

Apparatus and methods are provided for improving yield and frequency performance of integrated circuit processors, such as multiple-core processors. In an example, an apparatus can include a plurality of clock buffers, each clock buffer of the plurality of clock buffers configured to receive a first clock signal and distribute a plurality of second clock signals, a one-time programmable locate critical path mechanism configured provide a plurality of indications to enable or disable a delay of each clock buffer of the plurality of clock buffers, and a power management control circuit configured to over-ride one or more of the plurality of indications in a first non-test mode of operation of the apparatus and to not over-ride the one or more indications in a second non-test mode of operation of the apparatus.

Die-to-die connectivity monitoring

An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.

INTEGRATED SKEW CONTROL
20180329448 · 2018-11-15 ·

Disclosed aspects relate to a clock distribution network of a synchronous logic device. The synchronous logic device has sub-circuits having different clock domains. The clock domains form a hierarchical structure. The clock distribution network has a clock source to provide a global clock signal. A programmable delay line associated with a sub-circuit generates a local clock signal for the sub-circuit by delaying the signal. A global skew control circuit can manage clock skew between the local clock signals. The global skew control circuit may adjust a delay, determine initial operations for the delay lines, verify whether it is possible to perform the initial operations, and perform a correction operation. The correction operation can include correcting the control commands such that the corrected commands lead to the same change of skew adjustment between the local clocks.

Apparatuses and methods for partial bit de-emphasis
10128843 · 2018-11-13 · ·

Apparatuses and methods for partial bit de-emphasis are provided. An example apparatus includes an output driver and control circuit. The output driver includes a pull-up circuit including one or more pull-up legs, and a pull-down circuit including one or more pull-down legs. The control circuit may be coupled to the output driver and configured to receive an input signal having a first logical value and a second logical value, and in response to determining the logical transition has occurred from the second logic value to the first logic value, cause the pull-up circuit and pull-down circuit respectively to enter a first state for a duration of a first portion of a bit period and to enter a second state for a duration of a second portion of the bit period preceding the first portion.

Internal voltage generation circuit
10110227 · 2018-10-23 · ·

An internal voltage generation circuit includes a comparison circuit, a driving signal generation circuit and a driving circuit. The comparison circuit generates a comparison signal from an internal voltage in response to a reference voltage. The driving signal generation circuit generates a pull-up driving signal and a pull-down driving signal having different duty ratios in response to the comparison signal. The driving circuit drives the internal voltage in response to the pull-up driving signal and the pull-down driving signal.

Semiconductor device
10110228 · 2018-10-23 · ·

A semiconductor device may include: a first circuit suitable or generating a limit strobe signal by limiting a toggling period of a strobe signal depending on a change of an input code signal; and a second circuit suitable for synchronizing the input code signal based on the limit strobe signal and outputting a synchronized input code signal as an output code signal.

DATA PROCESSING CIRCUITS

A data-processing-circuit comprising: a clock-input-terminal configured to receive a clock-signal; a data-output-terminal configured to provide a data-output-signal; an adjustable-driver-buffer configured to: receive a data-signal; and apply a driver-strength-value to the data-signal in order to provide a data-output-signal, wherein the current level of the data-output-signal is based on the driver-strength-value; and a driver-control-module comprising: a time-alignment-module configured to: process the clock-signal and the data-output-signal in order to determine a timing-delay-signal that is representative of a time delay between: a transition in the clock-signal; and a transition in the data-output-signal; provide the driver-strength-value for the adjustable-driver-buffer based on the timing-delay-signal and a target-delay-signal, wherein the driver-strength-value is for reducing a difference between: the timing-delay-signal; and the target-delay-signal.

Hold-Time Compensation Using Free Metal Segments
20180278253 · 2018-09-27 ·

Methods and apparatuses pertaining to hold-time compensation using free metal segments or other electrically-conductive segments of an IC are described. An integrated circuit (IC) having free segment hold-time compensation may include a monolithic semiconductor substrate which has a first device and a second device disposed thereon. In addition, the IC may include an electrical node electrically connecting the first and second devices. The electrical node may include one or more electrically-conductive elements that contribute to a total capacitance at the electrical node such that the total capacitance at the electrical node has a value that fulfills a hold-time requirement at the electrical node.