An apparatus includes a first input/output (I/O) interface circuit having a maximum voltage rating. The first I/O interface circuit includes a level shifter and an output stage. A reference voltage bias generator is coupled to the first I/O interface circuit, to a first supply voltage, and to a first ground potential. The reference voltage bias generator is configured to generate a plurality of reference bias signals, including a first reference voltage and a second reference voltage. When the first supply voltage is not greater than the maximum voltage rating, the first reference voltage is equal to the first supply voltage and the second reference voltage is equal to the first ground potential. When the first supply voltage is greater than the maximum voltage rating, the first reference voltage is equal to the first supply voltage times a first fraction, and the second reference voltage is equal to the first supply voltage times a second fraction.

The present invention addresses the problem of many man-hours being required for a hardware engineer to adjust a resistance value such that the rise time of a signal input to an LSI body falls within a defined range. To solve this problem, the present invention provides a control circuit provided with: a conductive wire for transmitting an input electric signal to an integrated circuit; a resistance circuit which has a variable resistance value and which is connected to the conductive wire and grounded; a measurement means for measuring a rise time of the electric signal transmitted through the conductive wire, that is, the amount of time it takes for the voltage value of the electric signal to reach a predetermined second voltage value from a predetermined first voltage value, said predetermined second voltage value being higher than the first voltage value; and a control means for changing the resistance value of the resistance circuit to a value which is lower by a specific amount when the time measured by the measurement means is shorter than the minimum time of a predetermined time range, and changing the resistance value to a value which is higher by a specific amount when the time measured by the measurement means is longer than the maximum time of the predetermined time range. The control means outputs a predetermined signal upon having changed the resistance value a predetermined number of times.

Devices and/or computer-implemented methods to facilitate ZZ cancellation between qubits are provided. According to an embodiment, a device can comprise a coupler device that operates in a first oscillating mode and a second oscillating mode. The device can further comprise a first superconducting qubit coupled to the coupler device based on a first oscillating mode structure corresponding to the first oscillating mode and based on a second oscillating mode structure corresponding to the second oscillating mode. The device can further comprise a second superconducting qubit coupled to the coupler device based on the first oscillating mode structure and the second oscillating mode structure.

Local on-die termination controllers for effecting termination of a high-speed signaling links simultaneously engage on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. A termination control bus is coupled to memory devices on a module, and provides for peer-to-peer communication of termination control signals.

The circuit device includes a first MOS transistor of a first conductivity type a source of which is coupled to a first power supply voltage node, a second MOS transistor of a second conductivity type a source of which is coupled to a second power supply voltage node, a first variable resistance circuit which is coupled between a drain of the first MOS transistor and an output node, and which includes a first switch, and a second switch coupled between the drain of the first MOS transistor and the second power supply voltage node. The control circuit performs control of making the first switch OFF and making the second switch ON when the clock signal fails to be output from the output node, and making the first switch ON and making the second switch OFF when the clock signal is output from the output node.

A semiconductor apparatus may include logic circuits and a control logic. The control logic may be configured to monitor characteristics of the logic circuits to allow the semiconductor apparatus to perform at different operating speeds.

An integrated circuit provides a semiconductor die with I/O bond pads, a power bond pad, and a circuit ground pad. Each I/O bond pad is associated with an input circuit that has an input circuit output lead. Sets of digital logic functional circuitry on the die provide different digital logic functions. Each function includes logic input leads and logic output leads. Output circuits each have an output circuit in lead and an output circuit out lead. Strapping structures, such as vias, formed in the semiconductor die electrically couple input circuits to a selected set of digital logic functions and the selected set of digital logic functions to output circuit in leads. Upper level metal conductors couple output circuit out leads and selected I/O bond pads.

The present application provides a differential signal interface and a display device adopting the differential signal interface. A plurality of different differential signals are transmitted between a transmitting end and a receiving end of the differential signal interface by a plurality of differential pairs. A plurality of moderating modules are disposed between the transmitting end and the receiving end. Each moderating module is connected to a corresponding differential pair and is configured to adjust the impedance of the transmitting end and/or the receiving end such that the impedance of the transmitting end and/or the receiving end matches the impedance of the corresponding differential pair.

Main wiring including a plurality of differential transmission lines for transmitting differential signals is formed on a motherboard. Termination resistors, provided at both ends of each of the plurality of differential transmission lines, connect the plurality of differential transmission lines to each other. A plurality of daughter boards are connected in parallel to each other via the main wiring. A line characteristic impedance of each differential transmission line is higher than a termination resistance value, which is a resistance value of the termination resistor.

An electronic device includes a die stack having a plurality of die. The die stack includes a die parity path spanning the plurality of die and configured to alternatingly identify each die as a first type or a second type. The die stack further includes an inter-die signal path spanning the plurality of die and configured to propagate an inter-die signal through the plurality of die, wherein the inter-die signal path is configured to invert a logic state of the inter-die signal between each die. Each die of the plurality of die includes signal formatting logic configured to selectively invert a logic state of the inter-die signal before providing it to other circuitry of the die responsive to whether the die is designated as the first type or the second type.