Patent classifications
H03K19/018
Semiconductor module and semiconductor package
A semiconductor module includes: a control circuit for controlling first and second transistors operating complementarily; and an internal controller receiving a data signal including a set value of an operating characteristic from an external controller to store the data signal in a memory and then transferring the set value of the operating characteristic to the control circuit. The data signal is sent to the internal controller in the order of the set value of the operating characteristic and a specific trigger value. The internal controller transfers the set value of the operating characteristic to the control circuit in timed relation to writing of the specific trigger value into the memory. The control circuit includes first and second drivers. The control circuit changes settings of the first and second drivers to thereby change the operating characteristic of the semiconductor module.
INPUT/OUTPUT CIRCUIT
For a single input/output circuit, changing an input/output form is enabled by a simple configuration. In the input/output circuit, a circuit section includes power supply terminals and ground terminals. A switching section is switchable between a first state in which a power supply line and a ground line are coupled to one of the power supply terminals and one of the ground terminals and a second state in which the power supply line and the ground line are coupled to the other one of the power supply terminals and the other one of the ground terminals. The circuit section operates as a circuit corresponding to one of an open collector output and an open emitter output in the first state and operates as a circuit corresponding to the other one of the open collector output and the open emitter output in the second state.
APPARATUS FOR TRANSMITTING AND RECEIVING A SIGNAL, A METHOD OF OPERATING THE SAME, A MEMORY DEVICE, AND A METHOD OF OPERATING THE MEMORY DEVICE
A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
SEMICONDUCTOR MODULE AND SEMICONDUCTOR PACKAGE
A semiconductor module includes: a control circuit for controlling first and second transistors operating complementarily; and an internal controller receiving a data signal including a set value of an operating characteristic from an external controller to store the data signal in a memory and then transferring the set value of the operating characteristic to the control circuit. The data signal is sent to the internal controller in the order of the set value of the operating characteristic and a specific trigger value. The internal controller transfers the set value of the operating characteristic to the control circuit in timed relation to writing of the specific trigger value into the memory. The control circuit includes first and second drivers. The control circuit changes settings of the first and second drivers to thereby change the operating characteristic of the semiconductor module.
Method for implementing Vptat multiplier in high accuracy thermal sensor
A temperature sensing circuit a switched capacitor circuit selectively samples Vbe and Vbe voltages and provides the sampled voltages to inputs of an integrator. A quantization circuit quantizes outputs of the integrator to produce a bitstream. When a most recent bit of the bitstream is a logic zero, operation includes sampling and integration of Vbe a first given number of times to produce a voltage proportional to absolute temperature. When the most recent bit of the bitstream is a logic one, operation includes cause sampling and integration of Vbe a second given number of times to produce a voltage complementary to absolute temperature. A low pass filter and decimator filters and decimates the bitstream produced by the quantization circuit to produce a signal indicative of a temperature of a chip into which the temperature sensing circuit is placed.
Method for implementing Vptat multiplier in high accuracy thermal sensor
A temperature sensing circuit a switched capacitor circuit selectively samples Vbe and Vbe voltages and provides the sampled voltages to inputs of an integrator. A quantization circuit quantizes outputs of the integrator to produce a bitstream. When a most recent bit of the bitstream is a logic zero, operation includes sampling and integration of Vbe a first given number of times to produce a voltage proportional to absolute temperature. When the most recent bit of the bitstream is a logic one, operation includes cause sampling and integration of Vbe a second given number of times to produce a voltage complementary to absolute temperature. A low pass filter and decimator filters and decimates the bitstream produced by the quantization circuit to produce a signal indicative of a temperature of a chip into which the temperature sensing circuit is placed.
Apparatus for transmitting and receiving a signal, a method of operating the same, a memory device, and a method of operating the memory device
A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
APPARATUS FOR TRANSMITTING AND RECEIVING A SIGNAL, A METHOD OF OPERATING THE SAME, A MEMORY DEVICE, AND A METHOD OF OPERATING THE MEMORY DEVICE
A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.
Voltage level shifting circuitry
Various implementations described herein refer to an integrated circuit having a first stage and a second stage. The first stage has first transistors arranged as a diode, a first latch and feedback assist to facilitate shifting an input voltage in a first voltage domain to an output voltage in a second voltage domain. The first stage uses the diode and the first latch to reduce contention between the first latch and input transistors. The diode, the first latch and the feedback assist enable activation of the input transistors with the input voltage. The second stage has second transistors arranged as a second latch followed by output buffers that provide a buffered output voltage as feedback to the feedback assist of the first stage.
Off chip driver circuit, off chip driver compensation system and signal compensation method
An OCD circuit includes a pull-up circuit, a pull-down circuit, a first and a second compensation circuit. The pull-up circuit is enabled in response to an input data. The pull-down circuit is enabled in response to the input data. The first compensation circuit is coupled to the pull-up circuit and configured to induce a first compensation signal to the pull-up circuit in response to a first decision signal. The second compensation circuit is coupled to the pull-down circuit and configured to induce a second compensation signal to the pull-down circuit in response to a second decision signal. The first decision signal and the second decision signal are generated in response to the input data.