The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Temperature compensated oscillators are provided. The oscillator comprises an oscillator circuit and a temperature compensation module. The temperature compensation module reduces temperature induced errors in the frequency of oscillation of the oscillator by providing a temperature compensation signal to the oscillator circuit based on a temperature sensor output. The temperature compensation module comprises a low pass filter configured to reduce noise in the temperature compensation signal. The low pass filter is such that, using Laplace representations of transfer functions, the transfer function H(s) of the filter is equivalent to the transfer function of a closed loop configuration in which a module having an open loop transfer function G(s) is configured to generate an output from the closed loop configuration by applying the open loop transfer function G(s) to an error between an input to the closed loop configuration and the output from the closed loop configuration.

An oscillation circuit includes a first oscillation circuit configured to oscillate a resonator to generate a first oscillation signal, a second oscillation circuit configured to generate a second oscillation signal, a frequency measurement circuit configured to measure a frequency of the second oscillation signal based on the first oscillation signal in a first period in which the first oscillation circuit is in operation, a holding circuit configured to hold a measurement result by the frequency measurement circuit in a second period in which the first oscillation circuit is not in operation, and an oscillation signal generation circuit configured to generate a third oscillation signal based on the second oscillation signal and the measurement result held in the holding circuit in a third period in which the first oscillation circuit starts up, wherein the third oscillation signal is supplied to the first oscillation circuit in the third period.

A circuit device includes an oscillation circuit and a processing circuit. The oscillation circuit includes a variable capacitance circuit configured by a capacitor array and oscillates at an oscillation frequency corresponding to the capacitance value of the variable capacitance circuit. First temperature data and second temperature data subsequent to the first temperature data are input to the processing circuit as temperature data. In the period between the start of the capacitance control based on the first temperature data and the start of the capacitance control based on the second temperature data, the processing circuit switches the first capacitance control data corresponding to the first temperature data and the second capacitance control data different from the first capacitance control data in a time-division manner to be output to the variable capacitance circuit.

A vibration device includes: a first substrate including a first surface and a second surface located at an opposite side of the first surface, and a first integrated circuit disposed on at least one of the first surface and the second surface; a second substrate including a third surface bonded to the second surface, a fourth surface located at an opposite side of the third surface, a recess that opens to the third surface, and a second integrated circuit disposed on the fourth surface; and a vibration element accommodated in a space defined by an opening of the recess being closed by the first substrate.

In one embodiment, a device in a low-power and lossy network (LLN) makes, based on a temperature measurement, a first adjustment to a frequency for a wireless channel used by the device to communicate with one or more neighboring devices in the LLN. The device receives, via the wireless channel, a packet from one of the neighboring devices that indicates a transmit frequency for the packet. The device calculates a frequency offset based on a difference between the transmit frequency for the packet and the adjusted frequency for the wireless channel. The device makes, based on the calculated frequency offset, a second adjustment to the frequency for the wireless channel used by the device to communicate with the one or more neighboring devices in the LLN.

Method and system for temperature-dependent frequency compensation. For example, the method for temperature-dependent frequency compensation includes determining a first frequency compensation as a first function of temperature using one or more crystal oscillators, processing information associated with the first frequency compensation as the first function of temperature, and determining a second frequency compensation for a crystal oscillator as a second function of temperature based on at least information associated with the first frequency compensation as the first function of temperature. The one or more crystal oscillators do not include the crystal oscillator, and the first frequency compensation as the first function of temperature is different from the second frequency compensation as the second function of temperature.

A circuit includes an oscillator having a driver and a resonator. The driver receives a supply voltage at a supply input and provides a drive output to drive the resonator to generate an oscillator output signal. A power converter receives an input voltage and generates the supply voltage to the supply input of the driver. A temperature tracking device in the power converter controls the voltage level of the supply voltage to the supply input of the driver based on temperature such that the supply voltage varies inversely to the temperature of the circuit.

Embodiments of the present disclosure provide a server data sending method and a server data sending apparatus. The method can include: acquiring, by a server, crystal oscillator error information and operating rate information of a terminal; setting, by the server, preamble length information according to the crystal oscillator error information and the operating rate information; and sending, by the server, a downlink data frame to the terminal, the downlink data frame comprising a preamble aligned with the preamble length information.

In an oscillator device that outputs a frequency signal based on an oscillation frequency of a crystal resonator and a frequency setting value, a frequency difference detector that obtains a difference value corresponding to a frequency difference between the output frequency of the oscillator device and an external clock signal and a temperature detector are disposed. An aging coefficient and a temperature characteristic coefficient are obtained based on a secular change of the difference value obtained in the frequency difference detector and a secular change of the detected temperature during a period where the external clock signal is obtained. Furthermore, a frequency correction value is calculated using the aging coefficient and the temperature characteristic coefficient during a holdover period, and the frequency correction value is added to the frequency setting value.