The disclosure relates to a temperature-controlled oscillator. Embodiments disclosed include a temperature-compensated oscillator (100) comprising: a first capacitive charging circuit (101) connected between a supply voltage connection (104) and a common connection (105), comprising a first transistor (106) and a first capacitor (107), the first transistor (106) arranged to switch states when the first capacitor (107) is charged above a threshold voltage of the first transistor (106); a second capacitive charging circuit (102) connected between the supply voltage connection (104) and the common connection (105), comprising a second transistor (109) and a second capacitor (110) arranged to begin discharging when the first transistor (106) switches states, the second transistor (109) arranged to switch states when the second capacitor (110) is discharged below a voltage equal to a supply voltage (VDD) at the supply voltage connection (104) minus a threshold voltage of the second transistor (109); and a third capacitive charging circuit (103) connected between the supply voltage connection (104) and the common connection (105), comprising a third transistor (111) and a third capacitor (112) arranged to begin discharging when the second transistor (109) switches states, the third transistor (111) arranged to switch states when the third capacitor (112) discharges below a threshold voltage of the third transistor (111).

The disclosure relates to a temperature-controlled oscillator. Embodiments disclosed include a temperature-compensated oscillator (100) comprising: a first capacitive charging circuit (101) connected between a supply voltage connection (104) and a common connection (105), comprising a first transistor (106) and a first capacitor (107), the first transistor (106) arranged to switch states when the first capacitor (107) is charged above a threshold voltage of the first transistor (106); a second capacitive charging circuit (102) connected between the supply voltage connection (104) and the common connection (105), comprising a second transistor (109) and a second capacitor (110) arranged to begin discharging when the first transistor (106) switches states, the second transistor (109) arranged to switch states when the second capacitor (110) is discharged below a voltage equal to a supply voltage (VDD) at the supply voltage connection (104) minus a threshold voltage of the second transistor (109); and a third capacitive charging circuit (103) connected between the supply voltage connection (104) and the common connection (105), comprising a third transistor (111) and a third capacitor (112) arranged to begin discharging when the second transistor (109) switches states, the third transistor (111) arranged to switch states when the third capacitor (112) discharges below a threshold voltage of the third transistor (111).

Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC.

Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC.

The present invention provides an apparatus and method for supporting a mechanically stable and thermally isolated platform for operating sample devices which require extensive thermal isolation. The apparatus comprises a mounting base, a substrate, and microstructured tubes interconnecting the mounting base and substrate and having a thermally resistive inner portion and a thin coated layer that exhibits high electrical conductivity and low thermal emissivity. Radiation reflectors may be incorporated into the apparatus to protect components and reflect infrared radiation, and a getter equipped vacuum cover may be sealed to a vacuum header to maintain a low pressure environment within the apparatus.

An oscillator includes an oscillation circuit, an operation state signal generation circuit that generates an operation state signal based on an operation state of the oscillation circuit, and a first integrated circuit, the oscillation circuit and the operation state signal generation circuit are disposed outside the first integrated circuit, and the first integrated circuit includes a first digital interface circuit, a D/A conversion circuit that converts a digital signal input via the first digital interface circuit into an analog signal to generate a frequency control signal that controls a frequency of the oscillation circuit, and a terminal to which the operation state signal is input.

An oscillator includes an oscillation circuit, an operation state signal generation circuit that generates an operation state signal based on an operation state of the oscillation circuit, and a first integrated circuit, the oscillation circuit and the operation state signal generation circuit are disposed outside the first integrated circuit, and the first integrated circuit includes a first digital interface circuit, a D/A conversion circuit that converts a digital signal input via the first digital interface circuit into an analog signal to generate a frequency control signal that controls a frequency of the oscillation circuit, and a terminal to which the operation state signal is input.

A quantum interference device has an atomic cell which has alkali metal atoms disposed within. A light source emits light to excite the alkali metal atoms in the atomic cell. An optical element is disposed between the light source and the atomic cell, and enlarges the radiation angle of light emitted from the light source. A light detector detects light transmitted through the atomic cell.

A quantum interference device has an atomic cell which has alkali metal atoms disposed within. A light source emits light to excite the alkali metal atoms in the atomic cell. An optical element is disposed between the light source and the atomic cell, and enlarges the radiation angle of light emitted from the light source. A light detector detects light transmitted through the atomic cell.

A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.