There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.

An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

A timing device includes an oven having a chamber, a crystal oscillator disposed in the chamber that generates a clock signal, and one or more sensors to generate operational characteristic signals indicative of respective operational characteristics of the crystal oscillator or the oven. The timing device includes a plurality of I/O connections and an IC device. The IC device includes processing logic to generate information that indicates how the generated clock signal is to be modified and a modulator coupled to the processing logic and the crystal oscillator. The modulator modulates the generated clock signal in relation to the information to generate a modulated clock signal indicative of the one or more operational characteristics of the crystal oscillator or the oven. The modulator outputs the modulated clock signal over a single one of the plurality of I/O connections.

An integrated circuit device includes a heat generating circuit controlled based on a temperature control signal. The heat generating circuit includes a heat generating transistor including a plurality of transistors that have a gate voltage controlled based on the temperature control signal and are coupled in parallel. A resistance value of a source resistance of the heat generating transistor is smaller than a resistance value of a drain resistance of the heat generating transistor.

In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.

In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.

A temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator includes a resonator element including highly doped silicon and an actuator for exciting the resonator body into a resonance mode having a characteristic frequency-vs-temperature curve. The properties of the resonator element and the actuator are chosen such that the curve has a high-temperature turnover point at a turnover temperature of 85° C. or more. In addition, the oscillator comprises a thermostatic controller for keeping the temperature of the resonator element at said high turnover temperature.

A single-chamber-type temperature-sensor-provided crystal unit includes: a single chamber; and a quartz-crystal vibrating piece and a temperature sensor, provided in the single chamber. The quartz-crystal vibrating piece has a square planar shape. The quartz-crystal vibrating piece is secured in the single chamber at two securing portions via conductive members. The two securing portions are in proximities of both ends of a first side of the quartz-crystal vibrating piece. The temperature sensor has a rectangular parallelepiped shape. The temperature sensor is disposed such that a longitudinal surface of the temperature sensor is parallel to a line segment Y and the temperature sensor is close to a side of the two securing portions within the single chamber, when a line segment connecting the two securing portions is defined as the line segment Y.

A single-chamber-type temperature-sensor-provided crystal unit includes: a single chamber; and a quartz-crystal vibrating piece and a temperature sensor, provided in the single chamber. The quartz-crystal vibrating piece has a square planar shape. The quartz-crystal vibrating piece is secured in the single chamber at two securing portions via conductive members. The two securing portions are in proximities of both ends of a first side of the quartz-crystal vibrating piece. The temperature sensor has a rectangular parallelepiped shape. The temperature sensor is disposed such that a longitudinal surface of the temperature sensor is parallel to a line segment Y and the temperature sensor is close to a side of the two securing portions within the single chamber, when a line segment connecting the two securing portions is defined as the line segment Y.