A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.

A radio frequency module includes a module board; a first semiconductor device containing a first power amplifier and a second power amplifier; and a second semiconductor device containing a first switch, the first switch including a first terminal connected to the first power amplifier and a second terminal connected to the second power amplifier. In the radio frequency module, the first semiconductor device and the second semiconductor device are stacked together and disposed on the module board. An aspect of such a radio frequency module is that it is possible to achieve a compact form factor, although still provide RF transmit and receive capability. The RF module also includes external-connection terminals and a LNA, and the first semiconductor device and the low noise amplifier are disposed on mutually opposite surfaces of the module board.

A mounting base (14) is fixed to an antenna (13) or an antenna bracket (15) for supporting the antenna (13). A baseband unit (11) and an RF unit (12) are fixed to the mounting base (14). The baseband unit (11) fixed to the mounting base (14) is disposed to face a back part (132) of the antenna (13) and to form a space between the back part (132) and the first enclosure (111). The RF unit (12) fixed to the mounting base (14) is disposed in the space formed between the back part (132) of the antenna (13) and the baseband unit (11) and is coupled to a waveguide flange (132) of the antenna (13). Thus, for example, in a configuration of a point-to-point wireless apparatus in which an RF unit and a baseband unit are separated, restrictions on installation space of the apparatus can be facilitated.

A mounting base (14) is fixed to an antenna (13) or an antenna bracket (15) for supporting the antenna (13). A baseband unit (11) and an RF unit (12) are fixed to the mounting base (14). The baseband unit (11) fixed to the mounting base (14) is disposed to face a back part (132) of the antenna (13) and to form a space between the back part (132) and the first enclosure (111). The RF unit (12) fixed to the mounting base (14) is disposed in the space formed between the back part (132) of the antenna (13) and the baseband unit (11) and is coupled to a waveguide flange (132) of the antenna (13). Thus, for example, in a configuration of a point-to-point wireless apparatus in which an RF unit and a baseband unit are separated, restrictions on installation space of the apparatus can be facilitated.

A transmitter having a transmitter housing (3), an electronics unit (4) and a display unit (5), the electronics unit (4) having a connection for a measured value sensor (6), the electronics unit (4) being connected to the display unit (5), and the transmitter housing (3) having at least one cable gland (7). To allow for a particularly simple and secure external operation, at least one connection module (9) is arranged in the at least one cable gland (7), and the at least one connection module (9) has at least one operating element (10) for communication with the display unit (5) and/or the electronics unit (4).

A transmitter having a transmitter housing (3), an electronics unit (4) and a display unit (5), the electronics unit (4) having a connection for a measured value sensor (6), the electronics unit (4) being connected to the display unit (5), and the transmitter housing (3) having at least one cable gland (7). To allow for a particularly simple and secure external operation, at least one connection module (9) is arranged in the at least one cable gland (7), and the at least one connection module (9) has at least one operating element (10) for communication with the display unit (5) and/or the electronics unit (4).

Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.

Methods, systems, and apparatus for using antennas for millimeter wave contactless communication. One of the apparatuses is a communication device that includes a transducer configured to convert electrical signals into extremely high frequency (EHF) electromagnetic signals, the EHF electromagnetic signals substantially emitted from a first surface of the communication device, wherein the transducer is positioned on a substrate of the communication device, and an integrated circuit coupled to the substrate, wherein the transducer includes multiple parallel resonant antenna elements in an array.

A small cell networking device includes a compartment in which at least one printed circuit board (PCB) is mounted. At least three networking modules are mounted on the at least one PCB. A first one of the networking modules is arranged as a gateway to a first wireless network. A second one of the networking modules is arranged as a gateway to a second wireless network. A third one of the networking modules monitors network traffic in the first wireless network or second wireless network. First and second antennas are mounted to a first surface of the compartment, between a second surface of the compartment and the PCB. A third antenna is mounted to the second surface of the compartment between the second surface of the compartment and the PCB. The first, second, and third antennas are respectively coupled to the first, second, and third networking modules.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.