A transmission interface with noise reduction function includes a first circuit and a second circuit, for transmitting a signal from the first circuit to the second circuit or from the second circuit to the first circuit. The first circuit includes a first sub-winding and a first wire unit, and the second circuit includes a second sub-winding and a second wire unit. When an electromagnetic noise passes through the first sub-winding and the first wire unit, two loop currents are respectively generated, and the currents have opposite directions to cancel each other so as to reduce the electromagnetic noise. Or, when an emitting current corresponding to the signal flows through the first sub-winding and the first wire unit, two magnetic fields are respectively generated, and the magnetic fields have opposite directions to cancel each other so as to reduce the electromagnetic interference.

In an interface unit, a shield layer includes an aperture through which magnetic flux generated by a power feeding coil of an antenna passes. Since the antenna is smaller than the shield layer, the aperture is much smaller than the shield layer. Thus, noise constituted by electromagnetic waves that travel from inside to outside of a computer via an aperture provided in an upper surface cover is blocked. During communication, the antenna and the shield layer are electromagnetically coupled to each other, and the shield layer defines and functions as an antenna. This allows proper communication with a communication target.

A controller for a semiconductor switch is described that includes a transmitter and a receiver that communicate across galvanic isolation using an inductive coupling. An example controller includes first circuitry referenced to a first reference potential, second circuitry referenced to a second reference potential and galvanically isolated from the first circuitry, and an inductive coupling galvanically isolating the first circuitry and the second circuitry. The inductive coupling includes a first winding referenced to the first reference potential and a second winding referenced to the second reference potential, wherein the first circuitry includes signal reception circuitry coupled to the inductive coupling, wherein the signal reception circuitry includes one or more signal receivers coupled to the first winding to receive signals transmitted over the inductive coupling.

Methods and apparatus for detecting the presence of undesirable foreign matter in a region between a wireless power transmission apparatus and a power reception apparatus are described. First and second detection methods, based on different detection schemes, may be used to detect and distinguish the presence of foreign matter from misalignment during power transfer operation. A first detection method may be used before power is transferred to a load in a power reception apparatus, and a second detection method may be used while power is supplied to the load.

A packaged integrated circuit (IC) device includes a first set of stacked die having a first IC die, a first inductor in the first IC die, an isolation layer over the first IC die, a second IC die over the isolation layer, and a second inductor in the second IC die aligned to communicate with the first inductor, and a second set of stacked die having a third IC die, a third inductor in the third IC die, a second isolation layer over the third IC die, a fourth IC die over the second isolation layer, and a fourth inductor in the fourth IC die aligned to communicate with the third inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die, and the second isolation layer extends a second prespecified distance beyond a first edge of the fourth IC die.

A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

A communication barrier arrangement includes a first driver having a first interface for receiving signals from a first device destined for a second device, an isolation barrier including a first transformer for signal transfer and having a primary winding connected to the first driver and a secondary winding, a second driver connected to the secondary winding and having a first connection terminal for output of the signals towards the second device, a first signal conditioner having a second connection terminal for receiving the signals from the second driver and a second interface for delivering them to the second device and a protection circuit including a resistor in parallel with a first capacitor, the protection circuit being connected between the first and second connection terminals.

Radio frequency (RF) isolators are described, coupling circuit domains operating at different voltages. The RF isolator may include a transmitter which emits a directional signal toward a receiver. Layers of materials having different dielectric constants may be arranged to confine the emission along a path to the receiver. The emitter may be an antenna having an aperture facing the receiver.

The sampling data signal and the sampling synchronizing clock are generated by sampling the data signal and the synchronizing clock, and the first driving pulse signal and the second driving pulse signal are generated based on the sampling data signal and the sampling synchronizing clock, and the isolator is driven by the first driving pulse signal and the second driving pulse signal.

A data transceiver device for bus communication includes: first and second semiconductor areas; a galvanic isolation means to galvanically isolate the first and second semiconductor areas; an input for receiving a signal to be transferred from the first semiconductor area to the second semiconductor area; a first capacitor in a first signal path and a second capacitor in a second signal path, each capacitor having a first plate connected to the first semiconductor area and a second plate connected to the second semiconductor area and each arranged for transferring a version of the received signal via the first and second signal paths, respectively; storage means having memory states controllable by the versions of the received signal and arranged to derive from the versions of the received signal the memory states. The storage means is arranged to obtain from the memory states an output signal in according to the received signal.