A system for creating an adjustable delay in an optical signal. The system has an input interface for receiving an optical input signal. The system has a first optical modulator configured to shift the frequency of the optical input signal depending on a setting of the first optical modulator, thereby generating a modulated optical signal. The system includes at least two frequency selective reflectors configured to reflect the modulated optical signal, thereby providing a reflected signal. The system has a control circuit that adapts the setting of the first optical modulator such that a frequency shift of the optical input signal introduced by the first optical modulator is set by the control circuit. The frequency shift introduced by the first optical modulator corresponds to an operational frequency of one of the at least two frequency selective reflectors associated with the setting of the first optical modulator. The system has an output fiber that receives the reflected signal from the corresponding frequency selective reflector.

A system for creating an adjustable delay in an optical signal. The system has an input interface for receiving an optical input signal. The system has a first optical modulator configured to shift the frequency of the optical input signal depending on a setting of the first optical modulator, thereby generating a modulated optical signal. The system includes at least two frequency selective reflectors configured to reflect the modulated optical signal, thereby providing a reflected signal. The system has a control circuit that adapts the setting of the first optical modulator such that a frequency shift of the optical input signal introduced by the first optical modulator is set by the control circuit. The frequency shift introduced by the first optical modulator corresponds to an operational frequency of one of the at least two frequency selective reflectors associated with the setting of the first optical modulator. The system has an output fiber that receives the reflected signal from the corresponding frequency selective reflector.

A downhole optical communications system provided at a downhole location in use, the downhole communications system being for communicating between the downhole location and an uphole location, such as a surface location. The downhole optical communications system comprises a downhole optical transmitter configured to emit an optical signal for transmission over an optical transmission channel between the uphole location and the downhole optical transmitter; wherein the downhole optical transmitter is configured so as to produce a response to an optical signal received from the optical transmission channel and the downhole optical communications system is configured to determine data represented by the received optical signal from the response produced by the downhole optical transmitter.

An apparatus and method for computer network security based on Free-Space Optical Interconnections (FSOI) for board-to-board information transmission. The addition of a controllable, interlocked shutter system creates air-gapped isolation of the boards, allowing for increased obfuscation, and enhanced security.

An apparatus and method for computer network security based on Free-Space Optical Interconnections (FSOI) for board-to-board information transmission. The addition of a controllable, interlocked shutter system creates air-gapped isolation of the boards, allowing for increased obfuscation, and enhanced security.

An apparatus in one embodiment comprises a first stackable transmitter/receiver module. The first stackable transmitter/receiver module comprises a housing having first and second ends and multiple sides between the first and second ends, a first signal connector arranged at the first end of the housing, a second signal connector arranged at the second end of the housing, and one or more sets of interconnects arranged on respective ones of the sides of the housing. The first stackable transmitter/receiver module is configured for mated stacking with one or more additional stackable transmitter/receiver modules via the one or more sets of interconnects. A given one of the sets of interconnects of the first transmitter/receiver module is configured to mate with a corresponding complementary set of interconnects arranged on a side of a housing of one of the additional stackable transmitter/receiver modules when the first and additional modules are stacked.

An apparatus in one embodiment comprises a first stackable transmitter/receiver module. The first stackable transmitter/receiver module comprises a housing having first and second ends and multiple sides between the first and second ends, a first signal connector arranged at the first end of the housing, a second signal connector arranged at the second end of the housing, and one or more sets of interconnects arranged on respective ones of the sides of the housing. The first stackable transmitter/receiver module is configured for mated stacking with one or more additional stackable transmitter/receiver modules via the one or more sets of interconnects. A given one of the sets of interconnects of the first transmitter/receiver module is configured to mate with a corresponding complementary set of interconnects arranged on a side of a housing of one of the additional stackable transmitter/receiver modules when the first and additional modules are stacked.

The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a photo-sensitive layer on a first surface of a semiconductor substrate. The photo-sensitive layer has a top surface. The method also includes obtaining a first profile of the first surface of the semiconductor substrate, and obtaining a second profile of the top surface of the photo-sensitive layer. The method also includes calculating a vertical displacement profile of the semiconductor substrate according to the first profile and the second profile. An apparatus for manufacturing a semiconductor structure is also disclosed.

The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a photo-sensitive layer on a first surface of a semiconductor substrate. The photo-sensitive layer has a top surface. The method also includes obtaining a first profile of the first surface of the semiconductor substrate, and obtaining a second profile of the top surface of the photo-sensitive layer. The method also includes calculating a vertical displacement profile of the semiconductor substrate according to the first profile and the second profile. An apparatus for manufacturing a semiconductor structure is also disclosed.

A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.