A method of transmitting and receiving signals in a wireless local area network (WLAN) system and a device for the same are provided. More particularly, there are provided a method and a device for the same in which a station operating in an orthogonal frequency division multiplexing (OFDM) mode transmits and receives signals through two aggregated channels.

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may determine a set of modulations for a random access message associated with a two-step random access channel (RACH) procedure. The set of modulations may be either a first set of modulations or a second set of modulations that is different from the first set of modulations. The set of modulations may be determined based at least in part on whether a signal strength satisfies a signal strength threshold. The UE may transmit the random access message based at least in part on the determined set of modulations. The random access message may include a physical uplink shared channel modulated using the determined set of modulations. Numerous other aspects are provided.

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may determine a set of modulations for a random access message associated with a two-step random access channel (RACH) procedure. The set of modulations may be either a first set of modulations or a second set of modulations that is different from the first set of modulations. The set of modulations may be determined based at least in part on whether a signal strength satisfies a signal strength threshold. The UE may transmit the random access message based at least in part on the determined set of modulations. The random access message may include a physical uplink shared channel modulated using the determined set of modulations. Numerous other aspects are provided.

An isolated driver device comprises a first semiconductor die and a second semiconductor die galvanically isolated from each other. The second semiconductor die includes a signal modulator circuit configured to modulate a carrier signal to produce a modulated signal encoding information. A galvanically isolated communication channel implemented in the first semiconductor die and the second semiconductor die is configured to transmit the modulated signal from the second semiconductor die to the first semiconductor die. The second semiconductor die includes: a fault detection circuit configured to detect electrical faults in the second semiconductor die; a logic circuit coupled to the fault detection circuit and configured to assert a modulation bypass signal in response to a fault being detected by the fault detection circuit; and modulation masking circuitry configured to force the modulated signal to a steady value over a plurality of periods of the carrier signal in response to the modulation bypass signal being asserted. The first semiconductor die includes a respective logic circuit sensitive to the modulated signal and configured to detect a condition where the modulated signal has a steady value over a plurality of periods of the carrier signal, and to assert a fault detection signal in response to the condition being detected.

An isolated driver device comprises a first semiconductor die and a second semiconductor die galvanically isolated from each other. The second semiconductor die includes a signal modulator circuit configured to modulate a carrier signal to produce a modulated signal encoding information. A galvanically isolated communication channel implemented in the first semiconductor die and the second semiconductor die is configured to transmit the modulated signal from the second semiconductor die to the first semiconductor die. The second semiconductor die includes: a fault detection circuit configured to detect electrical faults in the second semiconductor die; a logic circuit coupled to the fault detection circuit and configured to assert a modulation bypass signal in response to a fault being detected by the fault detection circuit; and modulation masking circuitry configured to force the modulated signal to a steady value over a plurality of periods of the carrier signal in response to the modulation bypass signal being asserted. The first semiconductor die includes a respective logic circuit sensitive to the modulated signal and configured to detect a condition where the modulated signal has a steady value over a plurality of periods of the carrier signal, and to assert a fault detection signal in response to the condition being detected.

A method of compensating for IQ mismatch (IQMM) in a transceiver may include sending first and second signals from a transmit path through a loopback path, using a phase shifter to introduce a phase shift in at least one of the first and second signals, to obtain first and second signals received by a receive path, using the first and second signals received by the receive path to obtain joint estimates of transmit and receive IQMM, at least in part, by estimating the phase shift, and compensating for IQMM using the estimates of IQMM. Using the first and second signals received by the receive path to obtain estimates of the IQMM may include processing the first and second signals received by the receive path as a function of one or more frequency-dependent IQMM parameters.

A method is provided. In some examples, the method includes generating, by processing circuitry, a spread of chips representing an input bit. In addition, the method includes converting, by the processing circuitry, the spread of chips to a plurality of symbols comprising a pair of symbols. The method also includes mapping, by the processing circuitry, the pair of symbols to a single carrier signal and generating, by the processing circuitry, a radio-frequency (RF) signal based on the single carrier signal. The method further includes transmitting, by the processing circuitry via an antenna, the RF signal.

One example according to the present specification relates to a technique related to configuration of a preamble in a wireless LAN (WLAN) system. According to various embodiments, a receiving STA may receive an NDP frame. The NDP frame may comprise a first signal field and a second signal field. The first signal field may comprise first information about a PHY version. The second signal field may comprise second information about transmission of a PPDU, set on the basis of the first information. The receiving STA may perform channel sounding on the basis of the NDP frame.

One example according to the present specification relates to a technique related to configuration of a preamble in a wireless LAN (WLAN) system. According to various embodiments, a receiving STA may receive an NDP frame. The NDP frame may comprise a first signal field and a second signal field. The first signal field may comprise first information about a PHY version. The second signal field may comprise second information about transmission of a PPDU, set on the basis of the first information. The receiving STA may perform channel sounding on the basis of the NDP frame.

Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a receiver may receive, from a transmitter, an indication of a modulation signature associated with a reconfigurable intelligent surface (RIS). The receiver may receive a signal that uses the modulation signature, wherein the modulation signature identifies a link associated with the RIS and the transmitter. Numerous other aspects are described.