Provided herein are embodiments of a shoe component. The shoe component may include a toebox, an insole, an adhesive membrane, a thermal-resistant insert, a midsole, and an outsole. The insert may further include a footbed. The footbed may include an upper surface and a bottom surface. The insert may further include an upper laminate on the upper surface of the footbed and a lower laminate on the bottom surface of the footbed.

Provided herein are embodiments of a shoe component. The shoe component may include a toebox, an insole, an adhesive membrane, a thermal-resistant insert, a midsole, and an outsole. The insert may further include a footbed. The footbed may include an upper surface and a bottom surface. The insert may further include an upper laminate on the upper surface of the footbed and a lower laminate on the bottom surface of the footbed.

Systems, methods and devices for limiting the transfer of thermal energy in ski boots and slowing thermal energy conduction through the ski boots are provided. Devices may have an upper shell and a side band and an attachment device for attaching the device to the toe box area of ski boot. The devices may further comprise materials that are intended to limit the transfer of thermal energy.

Systems, methods and devices for limiting the transfer of thermal energy in ski boots and slowing thermal energy conduction through the ski boots are provided. Devices may have an upper shell and a side band and an attachment device for attaching the device to the toe box area of ski boot. The devices may further comprise materials that are intended to limit the transfer of thermal energy.