An imaging system includes an imaging apparatus including a first optical system that transmits first wavelength range light, and a first image sensor that receives the first wavelength range light guided by the first optical system, and a projector including a first light source that emits the first wavelength range light, and a second optical system that emits the first wavelength range light emitted from the first light source to a subject side, in which an optical specification of the first optical system and an optical specification of the second optical system correspond to each other, the first optical system includes a first optical element that is displaced by receiving power generated by a first drive source, and the second optical system includes a second optical element that is displaced by receiving power generated by a second drive source.

A multi-spectrum based image fusion apparatus is disclosed, which includes a light acquisition device, an image processor, and an image sensor having five types of photosensitive channels. The five types of photosensitive channels including red, green and blue RGB channels, an infrared IR channel and a full-band W channel. The light acquisition device acquires target light corresponding to incident light. The image sensor converts the target light into an image signal through the RGB channels, the IR channel and the W channel. The image processor analyzes the image signal into RGB color signals and a brightness signal, and fuses the RGB color signals and the brightness signal to obtain a fused image. The collection of the channels based on which the RGB color signals and the brightness signal are obtained includes the five types of photosensitive channels.

This application provides an image obtaining method and apparatus. The image obtaining method according to this application includes: obtaining first original image data, where the first original image data is captured by an image sensor based on an initial visible light exposure parameter and luminous intensity of an infrared illuminator; obtaining a luminance of a visible light image based on the first original image data; adjusting the visible light exposure parameter based on a first difference, where the first difference is a difference between the luminance of the visible light image and preset target luminance of the visible light image; obtaining a luminance of an infrared image based on the first original image data; adjusting the luminous intensity of the infrared illuminator based on a second difference, where the second difference is a difference between the luminance of the infrared image and preset target luminance of the infrared image.

Systems and methods herein provide for improving visibility in a scene. In one embodiment, a system includes a first camera device operable to capture images of a scene at a first band of wavelengths, and a second camera device operable to capture images of the scene at a second band of wavelengths. The first and second bands are different. The system also includes a processor communicatively coupled to the first and second camera devices, the processor being operable to detect an object in the scene based on a first of the images from the first camera device and based on a first of the images from the second camera device that was captured at substantially a same time as the first image from the first camera device, to estimate an obscurant in the scene based on the first images, and to estimate a visibility parameter of the scene based on the object and the estimated obscurant.

A method for forming a semiconductor image sensor includes following operation. A first substrate including a first bottom side and a first top side is provided. A first interconnect structure is disposed under the first bottom side of the first substrate. An insulating structure is formed over the first top side of the first substrate. A conductor penetrating the insulating structure and the first substrate is formed and a first bonding pad is formed in the insulating structure. A second substrate including a second bottom side and a second top side is provided with the second bottom side facing the first top side of the first substrate. A second interconnect structure is disposed under the second bottom side of the second substrate, and a second bonding pad is coupled to the second interconnect structure. The first bonding pad is bonded to the second bonding pad to form a first bonded structure.

An imaging apparatus includes an imaging optical system that has a light transmission characteristic of transmitting near-infrared light in a near-infrared light wavelength range including 1550 nm, and an imaging sensor that outputs an imaging signal by imaging the near-infrared light transmitted through the imaging optical system, the imaging sensor has sensitivity to heat radiation from a subject, and the imaging signal includes information regarding a heat radiation image by the heat radiation.

An image acquisition apparatus includes a first image sensor configured to obtain a first image based on detection of a light of a first wavelength band; a second image sensor configured to obtain a second image based on detection of a light of a second wavelength band that is wider than the first wavelength band; and a processor configured to obtain a third image having a spatial resolution corresponding to the first image and a color gamut corresponding to the second image based on the first image and the second image. The image acquisition apparatus may provide an image with a high spatial resolution and a wide color gamut.

An image sensing device, method, an electronic apparatus, and a medium are provided. The image sensing device includes an image acquisition circuit comprising a plurality of image acquisition layer arrays, where at least one of the plurality of image acquisition layer arrays includes a reference layer, a first acquisition layer, and a second acquisition layer. The first acquisition layer is located under the reference layer and is configured to interact with the reference layer, to which a first electric signal is applied, to generate a first image signal. The second acquisition layer is located under the first acquisition layer and is configured to interact with the first acquisition layer to generate a second image signal. An image processing circuit is connected with the image acquisition circuit and configured to generate a target image according to the first image signal and the second image signal.

A reading device includes a visible light source to irradiate a subject with light having a visible wavelength; an invisible light source to irradiate the subject with light having an invisible wavelength; first and second image sensors to receive reflected light from the subject being irradiated with the light having the visible wavelength and the light having the invisible wavelength, and circuitry. The first image sensor generates visible image data containing a first invisible component, and the second image sensor generates invisible image data of a second invisible component. The circuitry removes the first invisible component contained in the visible image data using the invisible image data. The circuitry multiplies the invisible image data with the correction coefficient that absorbs an individual variation in removal of the first invisible component, and the correction coefficient is generated based on the visible image data and the invisible image.

Methods to solve the problem of performing fusion of images acquired with two cameras with different type sensors, for example a visible (VIS) digital camera and an short wave infrared (SWIR) camera, include performing image space equalization on images acquired with the different type sensors before performing rectification and registration of such images in a fusion process.