Embodiments of the present application provide an image fusion method and a bifocal camera. The method includes: acquiring a thermal image captured by the thermal imaging lens and a visible light image captured by the visible light lens; determining a first focal length when the thermal imaging lens captures the thermal image and a second focal length when the visible light lens captures the visible light image; determining a size calibration parameter and a position calibration parameter of the thermal image according to the first focal length and the second focal length; adjusting a size of the thermal image according to the size calibration parameter, and moving an adjusted thermal image to the visible light image according to the position calibration parameter for registration with the visible light image, to obtain to-be-fused images; and fusing the to-be-fused images to generate a bifocal fused image.

An apparatus for measuring temperature of an object using compensation of board temperature include an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.

An apparatus for measuring temperature of an object using compensation of board temperature include an infrared light sensor module for providing output voltage due to the infrared light emitted by an object; a board temperature compensation module for compensating the provided output voltage to the output voltage at the reference configuration temperature of the board using a first function of output voltage to board temperature obtained at a reference configuration temperature of a blackbody; and a calculation module for obtaining the temperature of the object from the compensated output voltage using a second function of temperature of the blackbody to the output voltage obtained at a reference configuration temperature of the board.

A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.

A method for fault isolation includes: acquiring a thermal imaging picture of a surface of a to-be-tested chip, the thermal imaging picture being obtained by scanning the to-be-tested chip to which a test signal is applied through an infrared thermal imaging device, and analyzing the thermal imaging picture to obtain a phase angle of each point on the surface of the to-be-tested chip; acquiring a three-dimensional image of the surface of the to-be-tested chip, the three-dimensional image being obtained by scanning the to-be-tested chip to which the test signal is applied through an image scanning device, and analyzing the three-dimensional image to obtain a three-dimensional coordinate of each point on the surface of the to-be-tested chip; calculating a three-dimensional coordinate of the fault in the to-be-tested chip according to the phase angle and the three-dimensional coordinate of each point on the surface of the to-be-tested chip.

An apparatus for correcting a temperature of an object using a shutter according to one embodiment of the present disclosure may comprise a temperature measurement module for measuring the temperature of the object and a temperature of the shutter, a noise temperature calculation module for calculating the temperature due to noise using the measured temperature of the shutter, and a temperature correction module for correcting the temperature of the object by subtracting the calculated temperature due to noise from the measured temperature of the object.

An apparatus for correcting a temperature of an object using a shutter according to one embodiment of the present disclosure may comprise a temperature measurement module for measuring the temperature of the object and a temperature of the shutter, a noise temperature calculation module for calculating the temperature due to noise using the measured temperature of the shutter, and a temperature correction module for correcting the temperature of the object by subtracting the calculated temperature due to noise from the measured temperature of the object.

Some techniques are described herein for providing different modes, each mode allowing for a different sensor to detect data. For example, a first mode can be configured to detect data via a touch sensor, a second mode can be configured to detect data via an infrared camera, and a third mode can be configured to detect data via an optical camera. In such an example, different modes can be configured to detect data using a different set of sensors that are in communication with a computer system.

Some techniques are described herein for providing different modes, each mode allowing for a different sensor to detect data. For example, a first mode can be configured to detect data via a touch sensor, a second mode can be configured to detect data via an infrared camera, and a third mode can be configured to detect data via an optical camera. In such an example, different modes can be configured to detect data using a different set of sensors that are in communication with a computer system.

A method and system for field treatment. The method comprising a data collection unit for collecting data on a portion of a field; an interface for receiving a first parameter to be considered for treatment of said portion of said field and a first probability score threshold for said parameter; a calculation unit for calculating a first probability score of said first parameter in said data collected; and, a treatment unit for treating said portion of the field based on said first probability score for said first parameter and said first threshold.