A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

There is set forth herein a system including a camera device. In one embodiment the system is operative to perform image processing for detection of an event involving a human subject. There is set forth herein in one embodiment, a camera equipped system employed for fall detection.

An apparatus comprises: a camera module for obtaining a first image, the camera module having at least one port, each of the at least one ports being associated with an attachment position for receiving a second camera module for obtaining a second image; a processor for detecting a position of a second camera module and providing, to an image processing controller, information relating to at least one of the position of the second camera module and the first image obtained by the camera module; and a memory for storing the information relating to at least one of the position of the second camera module and the first image obtained by the camera module.

An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

An image pickup apparatus includes: an image pickup device that includes a light receiving surface, an opposite surface, a light receiving portion, and external electrodes connected to the light receiving portion; and a wiring board that includes a first main surface, a second man surface, and a wiring portion provided with first bonding electrodes bonded to the external electrodes, wherein the first main surface of the wiring portion is arranged at a first angle θ1 equal to or smaller than 90 degrees relative to the opposite surface, the wiring board includes a reinforced portion and a folded portion bent at the first angle θ1 between the reinforced portion and the wiring portion, and the second main surface of the reinforced portion is fixed to the opposite surface of the image pickup device.

An Internet of Thing (IoT) sport device includes a body with a processor, a camera and a wireless transceiver coupled to the processor.

A camera includes: a ring-like body mount having an inside diameter smaller than about 48 millimeters; and a solid-state image pickup device arranged oppositely to the body mount, the solid-state image pickup device having a rectangle light receiving section with a diagonal line length of about 43 millimeters or more. An apparent shape of the solid-state image pickup device viewed from a front surface side of the body mount is a rectangle in which one or more corners are oblique.

An image head including a housing, side rails, a port, and internal componentry. The housing includes a first side and a second side located opposite the second side. The side rails are located on or within the first side, the second side, or both and the side rails are configured to provide sliding directional control of the image head when connecting to a base. The port is configured to electrically connect the image head to the base. The internal componentry includes a printed circuit board; an integrated lens and sensor assembly (ISLA) configured to generate an image; and memory located on the printed circuit board configured to store the image.

An image head including a housing, side rails, a port, and internal componentry. The housing includes a first side and a second side located opposite the second side. The side rails are located on or within the first side, the second side, or both and the side rails are configured to provide sliding directional control of the image head when connecting to a base. The port is configured to electrically connect the image head to the base. The internal componentry includes a printed circuit board; an integrated lens and sensor assembly (ISLA) configured to generate an image; and memory located on the printed circuit board configured to store the image.

The disclosure provides a double barrels lens, a lens module, and an assembling method therefor. The double barrels lens includes a first barrel and a second barrel. The first barrel comprises a first end, a second end and a lens group. External screw threads are provided on an outer surface of the second end. The second barrel includes a first end surface, a second end surface and an inner surface with internal screw threads. The internal screw threads of the second barrel are engaged with the external screw threads of the first barrel. A distance H between an optical center of the lens group and the second end surface of the second barrel, a focal length f of the lens group, and a correction coefficient α meet the expression: H=f+α.