The disclosure provides a double barrels lens, a lens module, and an assembling method therefor. The double barrels lens includes a first barrel and a second barrel. The first barrel comprises a first end, a second end and a lens group. External screw threads are provided on an outer surface of the second end. The second barrel includes a first end surface, a second end surface and an inner surface with internal screw threads. The internal screw threads of the second barrel are engaged with the external screw threads of the first barrel. A distance H between an optical center of the lens group and the second end surface of the second barrel, a focal length f of the lens group, and a correction coefficient α meet the expression: H=f+α.

A method of manufacturing a camera module that is low profile and that can achieve superior resolving power, a camera module, and an imaging device are provided. A positioning step of positioning an object-side group optical unit (12a) along an optical axis direction with the use of a jig (40) such that the object-side group optical unit (12a) is located so as not to be in contact with an image-plane-side group lens (32a) and a fixing step of fixing the object-side group optical unit (12a) to a lens holder (20) are included.

A sensor apparatus includes a photosensitive sensor, a cover, and a moving mechanism. The photosensitive sensor includes a first lens and a second lens which focus on a photosensitive element. The cover includes a first slit arranged on an optical axis of the first lens and a second slit arranged on an optical axis of the second lens. The moving mechanism is configured to move the photosensitive sensor and the cover relative to each other so that the second slit is arranged on the optical axis of the first lens.

Provided is an electronic device. The electronic device includes: a main body mounted with an electronic unit including a controller, including a bezel disposed at the outer side thereof, and having a locking groove formed in the bezel; and a band part mounted with an additional device for exchanging an electric signal with the electronic unit and an electronic part providing information related to the additional device for the electronic unit, and including a coupling part detachably coupled to the locking groove. Here, the controller switches an operation mode of the main body according to the information related to the additional device provided by the electronic part when the main body and the band part are coupled to each other. Thus, when the band part mounted with the additional device is connected to the main body, the operation mode of the main body is automatically switched to a mode corresponding to the additional device, thereby providing convenience of use.

An image sensor device includes two or more image sensor arrays (or two or more regions of an image sensor array) and a low-power processor in a same package for capturing two or more images of an object, such as an eye of a user, using light in two or more wavelength bands, such as visible band, near-infrared band, and short-wave infrared band. The image sensor device includes one or more lens assemblies and/or a beam splitter for forming an image of the object on each of the two or more image sensor arrays. The image sensor device also includes one or more filters configured to select light from multiple wavelength bands for imaging by the respective image sensor arrays.

A lifting hook bias angle monitoring apparatus, a vertical hoisting monitoring apparatus, and a mobile crane. One method is that a lifting hook assembly serially connects connecting plates (b3) provided with hinge connection shafts (b2, b4) at two ends to a movable pulley component (b1) which bears a pulling force and a lifting hook component (b7) which bears a pulling force, and is also provided with a biaxial inclinometer (b9) on a platform surface (b8) of the connecting plates (b3) which is perpendicular to a lifting force line of action of the lifting pulley component, so as to detect a real-time lifting hook bias angle, and accordingly be developed into a mobile crane having a vertical hoisting monitoring function.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

An endoscope includes at least one lens having a circular exterior shape in a direction perpendicular to an optical axis, an image sensor that has a square exterior shape in the direction perpendicular to the optical axis, and has one side whose length is same as length of a diameter of the lens, a sensor cover that has a square exterior shape in the direction perpendicular to the optical axis, and has one side whose length is same as one side length of the image sensor, a bonding resin portion that fixes the sensor cover to the lens, the optical axis of the lens coinciding with a center of the imaging area.

The endoscope includes an imaging device that is provided in a tip portion of an insertion part capable of being inserted into a body cavity. The imaging device includes an image sensor that photoelectrically converts imaging light incident on an image receiving surface thereof through an imaging lens provided in a lens barrel, and a circuit substrate including a connecting surface facing a terminal face that is a surface opposite to the image receiving surface of the image sensor. A plurality of terminals are uniformly arranged longitudinally and laterally in a two-dimensional matrix form on the terminal face of the image sensor, and the connecting surface of the circuit substrate and the terminal face of the image sensor are connected to each other through the plurality of terminals. The total area of the plurality of terminals on the terminal face occupies 10% or more of the area of an imaging area of the image receiving surface.