Electronic devices comprising pixels for sensing, methods for operating the electronic devices, and methods for manufacturing the electronic devices are disclosed. In some embodiments, the electronic devices comprise hinges for supporting the pixels. In some embodiments, the electronic devices are configured to provide a bias voltage to the pixels.

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Various techniques are provided to compensate for and/or update ineffective (e.g., stale) calibration terms due to calibration drifts in infrared imaging devices. For example, a virtual-shutter non-uniformity correction (NUC) procedure may be initiated to generate NUC terms to correct non-uniformities when appropriate triggering events and/or conditions are detected that may indicate presence of an object or scene to act as a shutter (e.g., a virtual shutter). Scene-based non-uniformity correction (SBNUC) may be performed during image capturing operations of the infrared imaging device, for example, when a virtual-shutter scene is not available. Further, snapshots of calibration data (e.g., NUC terms) produced during the virtual-shutter NUC procedure, the SBNUC process, and/or other NUC process may be taken. Such snapshots may be utilized to provide useful NUC data when the infrared imaging device starts up or is otherwise reactivated, so that the SBNUC or other NUC methods may produce effective results soon after the start-up. Such snapshots may also be utilized to update ineffective calibration terms.

Deformable sensors having a stereo depth sensor and an infrared sensor and methods of their use are disclosed. In one embodiment, a deformable sensor includes an enclosure having a housing and a deformable membrane, wherein the deformable membrane is transparent to a wavelength band in the infrared spectrum, a stereo depth sensor that is disposed within the enclosure and is configured to view an underside of the deformable membrane, and output a deformation region of the deformable membrane as a result of contact with an object, wherein the deformation region includes depth information, and an infrared sensor that is disposed within the enclosure and is configured to view the object through the deformable membrane when the object contacts the deformable membrane and output a contact patch region corresponding with a region of the deformable membrane that contacts the object.

Deformable sensors having a stereo depth sensor and an infrared sensor and methods of their use are disclosed. In one embodiment, a deformable sensor includes an enclosure having a housing and a deformable membrane, wherein the deformable membrane is transparent to a wavelength band in the infrared spectrum, a stereo depth sensor that is disposed within the enclosure and is configured to view an underside of the deformable membrane, and output a deformation region of the deformable membrane as a result of contact with an object, wherein the deformation region includes depth information, and an infrared sensor that is disposed within the enclosure and is configured to view the object through the deformable membrane when the object contacts the deformable membrane and output a contact patch region corresponding with a region of the deformable membrane that contacts the object.

Various techniques are provided for an infrared sensor assembly having a hybrid infrared sensor array. In one example, such a hybrid infrared sensor array may include a plurality of microbolometers and a non-bolometric infrared sensor. The non-bolometric infrared sensor may be a thermopile or other type of infrared sensor different from a bolometer-based sensor. The non-bolometric infrared sensor may be utilized to provide a more accurate and stable temperature reading of an object or area of a scene captured by the array. In some embodiments, the non-bolometric infrared sensor may also be utilized to perform a shutter-less radiometric calibration of the microbolometers of the array. An infrared sensor assembly may include, for example, the hybrid infrared sensor array, as well as a substrate including bond pads and/or appropriate circuits to obtain and/or transmit output signals from the non-bolometric infrared sensor.

Various techniques are disclosed for systems and methods using thermal imaging to monitor an infant or other persons that may need observation. For example, an infant monitoring system may include an infrared imaging module, a visible light camera, a processor, a display, a communication module, and a memory. The monitoring system may capture thermal images of a scene including at least a partial view of an infant, using the infrared imaging module enclosed in a portable or mountable housing configured to be positioned for remote monitoring of the infant. Various thermal image processing and analysis operations may be performed on the thermal images to generate monitoring information relating to the infant. The monitoring information may include various alarms that actively provide warnings to caregivers, and user-viewable images of the scene. The monitoring information may be presented at external devices or the display located remotely for convenient viewing by caregivers.

Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Various techniques are provided for implementing an infrared imaging system, especially for low power and small form factor applications. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. A low-dropout regulator (LDO) is integrated with the FPA and adapted to provide a regulated voltage in response to an external supply voltage. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors in response to the regulated voltage. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Techniques are disclosed for measurement devices and methods to obtain various physical and/or electrical parameters in an integrated manner. For example, a measurement device may include a housing, an optical emitter, a sensor, a distance measurement circuit, a length measurement circuit, an electrical meter circuit, a display, an infrared imaging module, and/or a non-thermal imaging module. The device may be conveniently carried and utilized by users to perform a series of distance measurements, wire length measurements, electrical parameter measurements, and/or fault inspections, in an integrated manner without using multiple different devices. In one example, electricians may utilize the device to perform installation of electrical wires and/or other tasks at various locations (e.g., electrical work sites). In another example, electricians may utilize the device to view a thermal image of one or more scenes at such locations for locating potential electrical faults.