Deformable sensors having a stereo depth sensor and an infrared sensor and methods of their use are disclosed. In one embodiment, a deformable sensor includes an enclosure having a housing and a deformable membrane, wherein the deformable membrane is transparent to a wavelength band in the infrared spectrum, a stereo depth sensor that is disposed within the enclosure and is configured to view an underside of the deformable membrane, and output a deformation region of the deformable membrane as a result of contact with an object, wherein the deformation region includes depth information, and an infrared sensor that is disposed within the enclosure and is configured to view the object through the deformable membrane when the object contacts the deformable membrane and output a contact patch region corresponding with a region of the deformable membrane that contacts the object.

Deformable sensors having a stereo depth sensor and an infrared sensor and methods of their use are disclosed. In one embodiment, a deformable sensor includes an enclosure having a housing and a deformable membrane, wherein the deformable membrane is transparent to a wavelength band in the infrared spectrum, a stereo depth sensor that is disposed within the enclosure and is configured to view an underside of the deformable membrane, and output a deformation region of the deformable membrane as a result of contact with an object, wherein the deformation region includes depth information, and an infrared sensor that is disposed within the enclosure and is configured to view the object through the deformable membrane when the object contacts the deformable membrane and output a contact patch region corresponding with a region of the deformable membrane that contacts the object.

Deformable sensors having a stereo depth sensor and an infrared sensor and methods of their use are disclosed. In one embodiment, a deformable sensor includes an enclosure having a housing and a deformable membrane, wherein the deformable membrane is transparent to a wavelength band in the infrared spectrum, a stereo depth sensor that is disposed within the enclosure and is configured to view an underside of the deformable membrane, and output a deformation region of the deformable membrane as a result of contact with an object, wherein the deformation region includes depth information, and an infrared sensor that is disposed within the enclosure and is configured to view the object through the deformable membrane when the object contacts the deformable membrane and output a contact patch region corresponding with a region of the deformable membrane that contacts the object.

A thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.

A thermal image sensor includes a substrate; a composite layer including an absorption layer and a sensor array layer provided below the absorption layer, the sensor array layer including a plurality of temperature sensing cells, the composite layer having a pattern formed therein, and the pattern including at least one hole penetrating through the absorption layer; and a support separating the substrate from the composite layer.

Depth sensors comprising a focal plane array with photosites (PSs) directed in different directions, each PS operable to detect light arriving from an instantaneous field of view (IFOV) of the PS, a readout-set of readout circuitries (ROCs), each ROC coupled to readout-group PSs by multiple switches and operable to output an electric signal indicative of an amount of light impinging on the readout-group PSs when the read-out group is connected to the respective ROC via at least one of the switches, a controller operable to change switching states of the switches, such that at different times different ROCs of the readout-set are coupled to the readout-group and are exposed to reflections from different distances, and a processor operable to obtain the electric signals from the readout-set indicative of detected levels of reflected light collected from the IFOVs of the readout-group and to determine depth information for an object.

Depth sensors comprising a focal plane array with photosites (PSs) directed in different directions, each PS operable to detect light arriving from an instantaneous field of view (IFOV) of the PS, a readout-set of readout circuitries (ROCs), each ROC coupled to readout-group PSs by multiple switches and operable to output an electric signal indicative of an amount of light impinging on the readout-group PSs when the read-out group is connected to the respective ROC via at least one of the switches, a controller operable to change switching states of the switches, such that at different times different ROCs of the readout-set are coupled to the readout-group and are exposed to reflections from different distances, and a processor operable to obtain the electric signals from the readout-set indicative of detected levels of reflected light collected from the IFOVs of the readout-group and to determine depth information for an object.

A method for dynamic correction for pixels of thermal image array, which is applied to the factory correction of a bolometer, includes: individual resistance calculation step: at a reference temperature, a reference current is sequentially provided to the thermistors of all pixels in an image sensing array, to measure a corresponding resistance array values and recorded in a memory; individual current parameter calculation step: according to the resistance array values and a rated voltage value, respectively calculate a current array value, and record in the memory; and the step of confirming the rated voltage value: at the reference temperature, when reading the individual pixel voltage value of the image sensing array, provide the individual current parameter corresponding to each pixel according to the current array value, and confirm it corresponds to the rated voltage value.

A method for dynamic correction for pixels of thermal image array, which is applied to the factory correction of a bolometer, includes: individual resistance calculation step: at a reference temperature, a reference current is sequentially provided to the thermistors of all pixels in an image sensing array, to measure a corresponding resistance array values and recorded in a memory; individual current parameter calculation step: according to the resistance array values and a rated voltage value, respectively calculate a current array value, and record in the memory; and the step of confirming the rated voltage value: at the reference temperature, when reading the individual pixel voltage value of the image sensing array, provide the individual current parameter corresponding to each pixel according to the current array value, and confirm it corresponds to the rated voltage value.

A thermal imaging pixel, including a variable resistor array; and a pixel readout circuit configured to read electrical signals corresponding to a composite resistance of the variable resistor array, wherein the variable resistor array includes a plurality of variable resistor subarrays electrically connected in series, wherein each variable resistor subarray of the plurality of variable resistor subarrays includes a plurality of variable resistor cells electrically connected in parallel, and wherein each variable resistor cell of the plurality of variable resistor cells has a resistance which changes according to temperature.