A radiographic imaging system includes a radiographic detector programmed to display the patient identifying information in human readable form and to access information about the patient stored in locations accessible through a network. Embodiments of methods and/or apparatus for a radiographic imaging system can include a radiographic detector including an image receptor to receive incident radiation and generate uncorrected electronic image data; network accessible storage and/or processor to generate calibration-corrected image data from the uncorrected electronic image data provided from the detector. The calibration-corrected image data can be further processed by the network accessible processor before transmitting a corrected image (e.g., DICOM image) back to the radiographic imaging system.

Disclosed is an electronic device which includes a processing block, a crosstalk compensation block, and a dark level compensation block. The processing block receives image data from an active pixel region of an image sensor and performs pre-processing on the image data. The crosstalk compensation block performs crosstalk compensation on the pre-processed image data. The dark level compensation block performs the crosstalk compensation on dark level data received from an optical black region of the image sensor and performs a subtraction operation on the crosstalk-compensated image data and the crosstalk-compensated dark level data.

An imaging device includes a plurality of pixel sensors that respond to incident light. At least one drive-sense circuit is configured to generating a sensed signal corresponding to one of the plurality of pixel sensors. The at least one drive-sense circuit includes: a first conversion circuit configured to convert, a receive signal component of a sensor signal corresponding to the one of the plurality of pixel sensors into the sensed signal, wherein the sensed signal indicates a change in a capacitance associated with the one of the plurality of pixel sensors; a second conversion circuit configured to generate, based on the sensed signal, a drive signal component of the sensor signal corresponding to the one of the plurality of pixel sensors. The at least one drive-sense circuit is further configured to generate a plurality of other sensed signals corresponding to other ones of the plurality of pixel sensors for the other ones of the plurality of pixel sensors. A graphics processing module is configured to generate image data based on the sensed signal and the plurality of other sensed signals.

An embodiment includes: a semiconductor substrate including a pixel well region and a peripheral well region; a pixel ground line arranged above the pixel well region; a pixel well contact between the pixel ground line and the pixel well region; pixels arranged to form columns in the pixel well region; a reference signal generation circuit arranged in the peripheral well region; and comparator units arranged in the peripheral well region, provided to respective columns, and each configured to receive the pixel signal from the pixels on a corresponding column and the reference signal. Each comparator unit includes a comparator having a first input node that receives the pixel signal and a second input node that receives the reference signal, a first capacitor unit between the reference signal generation circuit and the second input node, and a second capacitor unit between the second input node and the pixel ground line.

An embodiment includes: a semiconductor substrate including a pixel well region and a peripheral well region; a pixel ground line arranged above the pixel well region; a pixel well contact between the pixel ground line and the pixel well region; pixels arranged to form columns in the pixel well region; a reference signal generation circuit arranged in the peripheral well region; and comparator units arranged in the peripheral well region, provided to respective columns, and each configured to receive the pixel signal from the pixels on a corresponding column and the reference signal. Each comparator unit includes a comparator having a first input node that receives the pixel signal and a second input node that receives the reference signal, a first capacitor unit between the reference signal generation circuit and the second input node, and a second capacitor unit between the second input node and the pixel ground line.

The present technology relates to a solid-state imaging device that can improve imaging quality by reducing variation in the voltage of a charge retention unit, a method of driving the solid-state imaging device, and an electronic apparatus. A first photoelectric conversion unit generates and accumulates signal charge by receiving light that has entered a pixel, and photoelectrically converting the light. A first charge retention unit retains the generated signal charge. A first output transistor outputs the signal charge in the first charge retention unit as a pixel signal, when the pixel is selected by the first select transistor. A first voltage control transistor controls the voltage of the output end of the first output transistor. The present technology can be applied to pixels in solid-state imaging devices, for example.

The present technology relates to a solid-state imaging device that can improve imaging quality by reducing variation in the voltage of a charge retention unit, a method of driving the solid-state imaging device, and an electronic apparatus. A first photoelectric conversion unit generates and accumulates signal charge by receiving light that has entered a pixel, and photoelectrically converting the light. A first charge retention unit retains the generated signal charge. A first output transistor outputs the signal charge in the first charge retention unit as a pixel signal, when the pixel is selected by the first select transistor. A first voltage control transistor controls the voltage of the output end of the first output transistor. The present technology can be applied to pixels in solid-state imaging devices, for example.

Thermal imaging systems can include an infrared camera module (200), a user interface (208), a processor (222), and a memory. The memory can include instructions to cause the processor (222) to perform a method upon a detected actuation from the user interface (208). The method can include performing a non-uniformity correction (1702) to reduce or eliminate fixed pattern noise from infrared image data from the infrared camera module (200). The method can include capturing infrared images (1704) at a plurality of times and register the captured images via a stabilization process (1706). The registered, non-uniformity corrected images can be used to perform a gas imaging process (1700). A processor (222) can be configured to compare an apparent background temperature in each of a plurality of regions of infrared image data to a target gas temperature. The processor (222) can determine if such regions lack sufficient contrast to reliably observe the target gas.

The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.

The present disclosure relates to a solid-state image pickup apparatus, a correction method, and an electronic apparatus, enabled to suppress an apparent uncomfortable feeling of an image output from a solid-state image pickup apparatus in which pixels of different OCL shapes are mounted mixedly. A solid-state image pickup apparatus according to an aspect of the present disclosure includes a pixel array in which a first pixel in which an OCL (On Chip Lens) of a standard size is formed and a second pixel in which an OCL of a size different from the standard size is formed are present mixedly, and a correction section that corrects a pixel value of the first pixel that is positioned in the vicinity of the second pixel among the first pixels on the pixel array. The present disclosure can be applied to, for example, a CMOS image sensor.