A substrate inspection method includes: capturing, while transporting a substrate with a fork, an image of a rear surface of the substrate using a line camera in which light receiving elements are arranged in a width direction orthogonal to a transport direction of the substrate; generating a corrected image by correcting the image captured in the capturing the image based on locus information of the fork when the substrate is being transported; and specifying feature information including a position of an abnormal portion existing on the rear surface of the substrate based on the corrected image.

A camera includes an image sensor having a first recording channel of a first sensitivity for recording first image data including first pixels and a second recording channel of a second sensitivity lower than the first sensitivity for recording second image data including second pixels. The first pixels and second pixels are associated with one another by capturing a same object area. A control and evaluation unit processing the image data is configured to suppress noise effects in the second image data using a noise suppression filter that assigns a new value to a respective considered second pixel based on second pixels in a neighborhood of the considered second pixel. The noise suppression filter takes the second pixels in the neighborhood into account with a weighting that depends on how similar first pixels associated with the second pixels are to the associated first pixel of the respective considered second pixel.

Examples of the present disclosure relate to a linear array of image sensor circuits including unused pixels. An example apparatus includes a linear array of image sensor integrated circuits, each integrated circuit including a plurality of pixels, each pixel including a light-sensitive element, and an unused pixel at a start of the integrated circuit. The apparatus further includes a processor, and a non-transitory machine readable medium storing instructions executable by the processor to receive programming instructions specifying a number of unused pixels associated with each integrated circuit, measure image data pixel signals from the linear array of image sensor integrated circuits, including the unused pixels, and disregard image data associated with the unused pixels.

A photoelectric conversion element includes a first pixel array including first light-receiving sections arranged in a direction and a second pixel array including second light-receiving sections arranged in the direction. Each of the first light-receiving sections includes a first pixel configured to receive at least light having a first wavelength inside a visible spectrum and a first pixel circuit configured to transmit a signal from the first pixel to a subsequent stage. Each of the second light-receiving sections includes a second pixel configured to receive at least light having a second wavelength outside the visible spectrum and a second pixel circuit configured to transmit a signal from the second pixel to the subsequent stage. The second pixel circuit is provided in a vicinity of the second pixel.

An image reading device includes a plurality of light-receiving pixels configured to receive reflected light; a first light-shielding member including a plurality of first openings and disposed between the plurality of light-receiving pixels and a reference surface; a second light-shielding member including a plurality of second openings and disposed between the plurality of first openings and the reference surface; and a plurality of condenser lenses disposed at a distance from the plurality of second openings. The plurality of condenser lenses, the second light-shielding member, the first light-shielding member, and the plurality of light-receiving pixels are disposed at positions at which reflected light sequentially passes through one of the condenser lenses corresponding to each light-receiving pixel, one of the second openings corresponding to the each light-receiving pixel, and one of the first openings corresponding to the each light-receiving pixel and enters the each light-receiving pixel.

Imaging devices are disclosed. In one example, an imaging device includes a pixel array with light-receiving pixels that are separated pixel lines, and that accumulating electric charge in an accumulation period. An exposure controller sets time lengths of the accumulation such that the time lengths repeat in predetermined order. The accumulation period includes a first accumulation period and a second accumulation period each having a first time length, and a third accumulation period and a fourth accumulation period each having a second time length. A processor generates image data by adding pixel values based on the accumulation result in a first pixel line in the first accumulation period, the accumulation result in a second pixel line in the second accumulation period, the accumulation result in the first pixel line in the third accumulation period, and the accumulation result in the second pixel line in the fourth accumulation period.

Imaging devices are disclosed. In one example, an imaging device includes a pixel array with light-receiving pixels that are separated pixel lines, and that accumulating electric charge in an accumulation period. An exposure controller sets time lengths of the accumulation such that the time lengths repeat in predetermined order. The accumulation period includes a first accumulation period and a second accumulation period each having a first time length, and a third accumulation period and a fourth accumulation period each having a second time length. A processor generates image data by adding pixel values based on the accumulation result in a first pixel line in the first accumulation period, the accumulation result in a second pixel line in the second accumulation period, the accumulation result in the first pixel line in the third accumulation period, and the accumulation result in the second pixel line in the fourth accumulation period.

To provide an imaging circuit and an imaging device capable of achieving switching of output types while a circuit scale is reduced. An imaging circuit according to the present disclosure includes: a photoelectric conversion element that converts incident light into a photocurrent; a first transistor that converts the photocurrent into a voltage signal; a second transistor that amplifies the voltage signal; a third transistor that controls a current to be supplied to the first transistor; and a fourth transistor that is connected to the second transistor.

To provide an imaging circuit and an imaging device capable of achieving switching of output types while a circuit scale is reduced. An imaging circuit according to the present disclosure includes: a photoelectric conversion element that converts incident light into a photocurrent; a first transistor that converts the photocurrent into a voltage signal; a second transistor that amplifies the voltage signal; a third transistor that controls a current to be supplied to the first transistor; and a fourth transistor that is connected to the second transistor.

An optical sensor includes first and second light detectors, an optical path, and an evaluation unit. The first light detector detects light in the infrared wavelength range. A light sensitivity of the CCD sensors of the first and second light detectors differ from one another with regard to a predefined wavelength range. The first and second light detectors include pixels in columns and situated next to one another so that a first longitudinal side of the first light detector adjoins a first longitudinal side of the second light detector, and the first and second light detectors receive light via the optical path. The first and second light detectors generate first and second measuring signals, respectively, from electrical charges. The evaluation unit receives the first measuring signals at a first sampling frequency and the second measuring signals at a second sampling frequency, and combines these to form an output signal.