A thermal management system for a power and fiber splice enclosure that includes a housing including electrical components is provided. The thermal management system includes a solar shield disposed external to the housing and covering at least a major portion of the housing. The thermal management system includes a vent disposed in the housing for venting hot air from the enclosure. The thermal management system includes a condenser thermally coupled to a heat conducting component of the enclosure for cooling at least the heat conducting component

A thermal management system for a power and fiber splice enclosure that includes a housing including electrical components is provided. The thermal management system includes a solar shield disposed external to the housing and covering at least a major portion of the housing. The thermal management system includes a vent disposed in the housing for venting hot air from the enclosure. The thermal management system includes a condenser thermally coupled to a heat conducting component of the enclosure for cooling at least the heat conducting component.

A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.

A thermal control system for pluggable optics in an optical telecom platform. The thermal control system comprises a thermal interface and one or more actuators. The thermal interface is configured to dissipate heat from a pluggable optical module in the optical telecom platform. The one or more actuators configured to change a position of the pluggable optical module relative to the thermal interface such that a thermal resistance between the pluggable optical module and the thermal interface is different based on a position of the pluggable optical module relative to the thermal interface.

The invention relates to a switch cabinet arrangement with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger comprises a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device comprises a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected. A corresponding method is further described.

A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.

A switch cabinet arrangement and method with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger includes a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device includes a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected.

A sub-rack for converting cooling pattern of a side-to-side cooled equipment is disclosed. According to an embodiment, the sub-rack comprises a first unit, a second cover disposed at a first lateral side of the first unit and a third cover disposed at a second lateral side of the first unit. The first unit comprises a first cover, a front side wall that is disposed at a front side of the first cover and has at least one inlet vent, a rear side wall that is disposed at a rear side of the first cover and has at least one outlet vent, and an air flow guiding member capable of guiding an air flow introduced from the at least one inlet vent to one of the first lateral side and the second lateral side of the first unit. The sub-rack further comprises. At least one cover of the second cover and the third cover is disposed to be movable relative to the first unit in a lateral direction via a first moving mechanism.

An optical midplane includes an airframe having a first side on which first modules are disposed and a second side on which second modules are disposed. The airframe is to provide for optimized airflow through the first modules disposed on the first side. A plurality of optical connectors are disposed at respective locations on the airframe to provide optical connectivity. Optical connectivity is provided between at least one of any first module disposed on the first side of the airframe and any second module disposed on the second side of the airframe, any first modules disposed on the first side of the airframe, and any second modules disposed on the second side of the airframe.

A module for a networking node is disclosed. The module includes a Printed Circuit Board (“PCB”), one or more circuits mounted to the PCB and a faceplate. The faceplate includes a middle plate, a first side plate, and a second side plate. The first side plate extends from the middle plate at an obtuse angle relative to the middle plate towards a first side and back of the module. The second side plate extends from the middle plate, opposite to the first side plate, at an obtuse angle relative to the middle plate towards a second side and the back of the module.