A device-frame for telecommunication devices includes a body-section that includes plug-in unit places for the telecommunication devices. The device-frame further includes an air-guide element movably supported to the body-section so that a flow area of an air-intake of the device-frame is increasable by changing the position of the air-guide element with respect to the body-section so that the height of the device-frame increases and the flow area is decreasable by changing the position of the air-guide element so that the height of the device-frame decreases. The height of the device-frame can be adjusted to be smaller in cases where the circumstances are not the most demanding from the viewpoint of the cooling and therefore, in less demanding circumstances, it is possible to have more device-frames in a rack.

Novel tools and techniques are provided for implementing telecommunications equipment shelf with integrated power and cooling. In various embodiments, a shelf for a telecommunications equipment mounting structure may be provided that includes one or more power outlets integrated within a body of the shelf, either on a front surface or a rear surface thereof, or both. Each power outlet may include a plurality of receptacles, each of which may be configured, when connected to an authenticated user device via network connectors that are integrated in the body of the shelf and via network cables, to send status information associated with the receptacle and/or its power outlet. In some cases, each shelf may further include a plurality of fans that is also integrated within the body of the shelf to provide air ventilation to cool one or more devices that may be held, supported, and/or mounted on the shelf.

In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.

An electrical system includes modules and a frame structure for mechanically supporting the modules successively in an arrival direction of cooling air. Each module includes a cooling element in heat conductive relation with one or more electrical components. The frame structure mechanically supports the modules so that the cooling elements are substantially in the same attitude and successively in the arrival direction of the cooling air. The cooling elements are shaped so that, when the modules are mechanically supported by the frame structure, the cooling elements conduct cooling air in a direction deviating from the arrival direction of the cooling air. Furthermore, at least a part of a flank of the heat transfer portion of each cooling element is oblique with respect to the arrival direction of the cooling air. Thus, each of the cooling elements receives a fresh portion of the cooling air.

Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.

An apparatus, comprising a linecard including a circuit board having a front side connectable to a pluggable optical module and a back side opposite the front side; a heat relay apparatus comprising a heat pipe on the circuit board; a pluggable optical module generating a first amount of heat and being in thermal contact with the heat pipe; and a cooling module including a heat sink in thermal contact with the heat pipe, the cooling module generating a second amount of heat in a range from the first amount of heat to no heat; and wherein heat from the pluggable optical module is transferable through the heat pipe to the cooling module for dispersal from the heat sink.

A connection management method, a controller, and a server cabinet are provided The method comprises: sending a command to the switch to instruct the switch to send a signal to a designated port of the switch; receiving from a compute node connected to the designated port of the switch, a response to the signal received by the compute node from the designated port of the switch; and based on pre-acquired location information of the compute node, associating the pre-acquired location information of the compute node with the designated port of the switch.

A device-frame for telecommunication devices includes a body-section that includes plug-in unit places for the telecommunication devices. The device-frame further includes an air-guide element movably supported to the body-section so that a flow area of an air-intake of the device-frame is increasable by changing the position of the air-guide element with respect to the body-section so that the height of the device-frame increases and the flow area is decreasable by changing the position of the air-guide element so that the height of the device-frame decreases. The height of the device-frame can be adjusted to be smaller in cases where the circumstances are not the most demanding from the viewpoint of the cooling and therefore, in less demanding circumstances, it is possible to have more device-frames in a rack.

The present disclosure relates to a subrack and a terminal. The subrack includes a chassis, a first main board region arranged in a front part of the chassis, and a second main board region arranged at a rear of the chassis and also includes: a first air duct arranged in the chassis and a second air duct arranged in the chassis, where the second air duct and the first air duct are separated.

The present invention discloses a communications product (100), including a remote radio module (10) and a mounting kit (30), where the mounting kit (30) includes a fastening part (32), the fastening part (32) is configured to mount and fasten the remote radio module (10) to a holder, the mounting kit (30) further includes a ventilation part (34) and an air supply part (36), an air source is disposed inside the air supply part (36), the ventilation part (34) is connected between the fastening part (32) and the air supply part (36), a ventilation channel is disposed inside the ventilation part (34), and the ventilation channel allows the air supply part (36) to communicate with the remote radio module (10), so that an air flow generated by the air source reaches the remote radio module (10) after passing through the ventilation channel, to dissipate heat for the remote radio module.