A Physical Layer (PHY) transceiver includes communication circuitry and a controller. The communication circuitry includes a digital filter, and is configured to communicate signals using the digital filter over a network link. The controller is configured to monitor a temperature pertaining to the communication circuitry, and, in response to detecting an actual or predicted over-temperature condition, to degrade a functionality of the digital filter so as to reduce power dissipation in the communication circuitry.

A switch cabinet arrangement and method with at least one IT rack or switch cabinet housing and with at least one cooling device, which has an air-liquid heat exchanger for cooling components accommodated in the IT rack or switch cabinet housing with cooled air, wherein the air-liquid heat exchanger includes a first flow for cooled liquid and a first return for heated liquid, wherein the cooling device includes a liquid-liquid heat exchanger, to the second flow of which the first return of the air-liquid heat exchanger is connected.

The present disclosure relates to a wireless data terminal, including a first main body, which includes a mainboard, the mainboard being provided with a first antenna; and a second main body, which is provided with a second antenna; where the second antenna can be connected to the mainboard, at least the second antenna is used for receiving and transmitting a cellular signal and a WiFi signal; and the second antenna can be disconnected from the mainboard, the first antenna is used for receiving and transmitting a cellular signal and a WiFi signal.

A communication device includes a housing assembly, a heat dissipation module and a communication main unit. The housing assembly includes a bottom cover, a mounting bracket and a positioning component. The mounting bracket is movably disposed on the bottom cover and movable between an installation position and a pre-installation position via a guiding structure. The positioning component is connected to the bottom cover and configured to fix the mounting bracket in the installation position in a detachable manner. The heat dissipation module is fixed to the bottom cover. The mounting bracket is located farther away from a heat-absorbing surface of the heat dissipation module when in the pre-installation position than in the installation position. The communication main unit is detachably disposed on the mounting bracket. When the mounting bracket is in the installation position, the communication main unit is in physical contact with the heat-absorbing surface.