Patent classifications
H04Q1/13
PATCH PANEL ASSEMBLY
A patch panel assembly, bezel and modular jacks are disclosed which allow modular jacks to be positioned closer together to increase patch panel density. In particular the modular jacks are equipped with features which engage openings which are offset, allowing for the modular jacks to be positioned closer together, in particular when arranged in adjacent parallel rows.
Bidirectionally installable intermediate modular adapter for a rack-mounted panel
A bidirectional intermediate modular adapter (500) can be installed from the front or the rear of a mounting panel. The body (502) of the modular adapter includes a front face (504), an opposing rear face (506), an opening (210) extending from the front face through the body to the opposing rear face, a first side surface (512) and an opposing second side surface (514), a flexible top surface (508) and an opposing lower surface (510). The flexible top surface has flexible beams (518A, 518B) and landings (528A, 528B), which define a deformable opening (520), and a first groove (526). The landings may have ramps (522A, 522B) at the sides thereof. The opposing lower surface has a second groove (540) extending at least partially lengthwise across thereof. The bidirectional intermediate modular adapter is preferably made of a nonconductive material with a conductive plating thereon.
High density bezel for patch panel
A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).
Integrated routing assembly and system using same
A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.
COMMUNICATIONS BLADED PANEL SYSTEMS
A fiber panel system includes a chassis and at least blades configured to mount to the chassis. Each blade is moveable relative to the chassis between a retracted (closed) position and at least one extended position. Cable slack is managed at the front and/or rear of each chassis to facilitate movement of the blades without pulling or bending the cables beyond a maximum bend limit. Each blade may be locked into one or more positions relative to the chassis.
Communication node
A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.
Cassette Adapter and Method of Installation
A cassette adapter for the installation of a cassette in a patch panel of a data rack including a base configured to accept the cassette, a front frame connected to a distal end of the base, at least one latch connected to the base, and a mounting portion configured to mount the cassette adapter to the panel. The cassette adapter being configured to retain the cassette within the cassette adapter and connect the cassette to the patch panel in a removable fashion.
PATCH PANEL WITH LIFTING CASSETTE REMOVAL
A patch panel includes a cabinet and a cassette. A pair of cassette guides is positioned within the cabinet. The pair of cassette guides are spaced along a lateral direction such that the cassette is receivable between the pair of cassette guides. The cassette is slidable along a transverse direction on the pair of cassette guides. At least one of the pair of cassette guides includes a first rail and a second rail that are spaced apart along a vertical direction. The cassette is slidable along the transverse direction between the first and second rails. Each end of the first rail is cantilevered such that each end of the first rail is moveable along the vertical direction.
High-density split cable
Disclosed is a high-density split cable for use in a network incorporating high-density connections for increased efficiency, network operation and management. The high-density connections are incorporated into the patch panel, network switch, and cables that connects them, as well as into cable analyzers and printed circuit boards (PCBs) which allow for a complete network within a single computer running virtualization software.
High-density switch up to 40 high-density jacks
Disclosed is a high-density switch for up to 40 high-density jacks for use in a network incorporating high-density connections for increased efficiency, network operation and management. The high-density connections are incorporated into the patch panel, network switch, and cables that connects them, as well as into cable analyzers and printed circuit boards (PCBs) which allow for a complete network within a single computer running virtualization software.