A backplane system for a high-speed network element includes a main backplane including a plurality of traces for data and control connectivity, high-speed data connectors, and a power connector, wherein the high-speed data connectors and the power connector are configured to engage one or more modules; and a power backplane for power connectivity separate from the main backplane connected to the power connector, wherein the power backplane is coupled to a power source to provide supply and return current to the one or more modules through the power connector.

A method for the recognition of spatial proximity relationships in a modular system having module assemblies, each module assembly having a transmitter and a receiver arranged so that the transmitter of a first module assembly corresponds to the receiver of a second module assembly, and each of the module assemblies having a network connection for connection via a communication network to other of the module assemblies, includes: automatically requesting and allocating a network address for each of the respective network connections via the communication network so as to enable an addressing of the module assemblies via the network; and determining spatial proximity relationships of the module assemblies by triggering and evaluating the transmitters and receivers using the communication network via the network connection.

A connector brick for a cable communication system includes a header frame including end spacers and side spacers defining a header opening. The header frame is configured for mating with a circuit card. A plurality of cable connectors are received in the header opening and connected to the header frame. Each cable connector has cables extending therefrom. Each cable connector has a header holding signal contacts at a mating end of the header and configured for mating with a corresponding card connector of the circuit card. Float mechanisms extend from the header frame. The float mechanisms allow limited movement in at least two directions of the header frame. The float mechanisms allow alignment of the header frame with the circuit card. The cable connectors float with the header frame as a unit for mating with the corresponding card connectors.

Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.

An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Right angle male connectors re arranged on each of the first boards and right angle female connectors are arranged on each of the second boards. The right angle male connectors and the right angle female connectors directly cooperate and are connected in one-to-one correspondence.

A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.

A modular, hybrid electrical connector suitable for use as a power connector with contacts for different types of power. Portions of the connector may be electrically and mechanically connected to an electronic assembly at different times or in different ways. A first portion of the connector may be electrically connected to a printed circuit board within the assembly. A second portion may be subsequently attached to the first portion and electrically connected to other components within the assembly through cables. With this configuration, the first portion may carry power contacts, coupled to a DC supply through the printed circuit board, and the second portion may carry power contacts, coupled to an AC supply through the cables. The first portion may be soldered to the printed circuit board such as through a reflow operation, without the heat of the reflow damaging the insulation of the cable, which may degrade if heated.

A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.

A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.

A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.