H04R3/06

HEARING AID SYSTEM AND A METHOD OF OPERATING A HEARING AID SYSTEM
20170245062 · 2017-08-24 · ·

A method (300) of operating a hearing aid system (100), wherein the dynamic range of input signal levels is improved by reducing the sensitivity of an input transducer in response to a trigger event while at the same time applying a gain adapted to compensate the reduced sensitivity and a hearing aid system (100, 200) adapted to carry out the method.

HEARING AID SYSTEM AND A METHOD OF OPERATING A HEARING AID SYSTEM
20170245062 · 2017-08-24 · ·

A method (300) of operating a hearing aid system (100), wherein the dynamic range of input signal levels is improved by reducing the sensitivity of an input transducer in response to a trigger event while at the same time applying a gain adapted to compensate the reduced sensitivity and a hearing aid system (100, 200) adapted to carry out the method.

ELECTROSTATIC EARPHONE WITH ADJUSTABLE ACOUSTIC TRANSPARENCY
20220312105 · 2022-09-29 ·

An electrostatic transducer including a membrane, a first electrode and a second electrode. The first electrode is disposed parallel to the membrane. The membrane is configured to respond mechanically to a varying first electric field in accordance with respective electric potentials applied between the first electrode and the membrane. The second electrode is disposed parallel to the membrane opposite from the first electrode. The membrane is configured to respond mechanically to a varying second electric field in accordance with respective electric potentials between the second electrode and the membrane. The first and second electrodes have through holes configured for acoustic transmission to and from the membrane. The housing includes: (i) a nozzle configured for acoustic transmission from the membrane through the holes of the first electrode to an ear canal and (ii) an aperture configured to provide acoustic transmission through the holes of the second electrode between the membrane and air external to the housing.

System and Method for Fast Mode Change of a Digital Microphone Using Digital Cross-Talk Compensation

A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.

System and Method for Fast Mode Change of a Digital Microphone Using Digital Cross-Talk Compensation

A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.

APPARATUS AND METHOD TO BIAS MEMS MOTORS

A microphone includes a first micro electro mechanical system (MEMS) motor, the first MEMS motor including a first diaphragm and a first back plate; and a second MEMS motor including a second diaphragm and a second back plate. The first diaphragm is electrically biased relative to the first back plate according to a first voltage, the second diaphragm is biased relative to the second back plate according to a second voltage, and a magnitude of the first voltage is different from a magnitude of the second voltage.

MICROELECTROMECHANICAL DEVICE, AN ARRAY OF MICROELECTROMECHANICAL DEVICES, A METHOD OF MANUFACTURING A MICROELECTROMECHANICAL DEVICE, AND A METHOD OF OPERATING A MICROELECTROMECHANICAL DEVICE

Aspects of a microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device, are discussed herein. The microelectromechanical device may include: a substrate; a diaphragm mechanically coupled to the substrate, the diaphragm comprising a stressed region to buckle the diaphragm into one of two geometrically stable positions; an actuator mechanically coupled to the diaphragm, the actuator comprising a piezoelectric layer over the diaphragm; a controller configured to provide an electrical control signal in response to a digital sound input; wherein the actuator is configured to receive the electrical control signal to exert a mechanical piezoelectric force on the diaphragm via the piezoelectric layer to move the diaphragm to create a sound wave.

MICROELECTROMECHANICAL DEVICE, AN ARRAY OF MICROELECTROMECHANICAL DEVICES, A METHOD OF MANUFACTURING A MICROELECTROMECHANICAL DEVICE, AND A METHOD OF OPERATING A MICROELECTROMECHANICAL DEVICE

Aspects of a microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device, are discussed herein. The microelectromechanical device may include: a substrate; a diaphragm mechanically coupled to the substrate, the diaphragm comprising a stressed region to buckle the diaphragm into one of two geometrically stable positions; an actuator mechanically coupled to the diaphragm, the actuator comprising a piezoelectric layer over the diaphragm; a controller configured to provide an electrical control signal in response to a digital sound input; wherein the actuator is configured to receive the electrical control signal to exert a mechanical piezoelectric force on the diaphragm via the piezoelectric layer to move the diaphragm to create a sound wave.

Sensor device and microphone assembly

This disclosure provides methods, systems, and apparatuses, for a microphone circuit. In particular, the circuit includes transducer that can sense pressure changes and generate an electrical signal having frequency components in a first frequency range and in a second frequency range higher than the first frequency range. The circuit includes a feedback circuitry that can attenuate frequency components in the first frequency range in the electrical signal and, from it, generate an audio signal. A feedback path circuit includes a low pass filter having a cut-off frequency within the first frequency range, and filters the audio signal to generate a low pass filter signal that includes frequency components in the first frequency range. The low pass filter signal can be used to generate a low frequency pressure signal that corresponds to low frequency pressure changes sensed by the transducer.

Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer

An acoustic transducer is configured to perform an acoustic transformation. The acoustic transducer is disposed within a wearable sound device or to be disposed within the wearable sound device. The acoustic transducer includes at least one anchor structure, a film structure and an actuator. The film structure is disposed within a first layer and anchored by the anchor structure disposed within a second layer. The actuator is disposed on the film structure, and the actuator is configured to actuate the film structure to form a vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal of a wearable sound device user and a second volume to be connected to an ambient of the wearable sound device. The ear canal and the ambient are to be connected via the vent temporarily opened when the film structure is actuated.