An acoustic device, comprising: a device body comprising: an acoustic membrane having a first surface and a second surface opposite the first surface; and at least one acoustic cavity formed adjacent the first surface of the acoustic membrane; a plurality of piezoelectric beam resonators supported over the first surface of the acoustic membrane and separated from the first surface by the at least one acoustic cavity, each of the plurality of piezoelectric beam resonators having at least one different natural frequency; wherein each of the plurality of piezoelectric beam resonators is configured to oscillate in response to sound pressure waves incident at the acoustic device.

A curable organopolysiloxane composition is provided. The composition has relatively low viscosity before curing, can be easily processed into a film shape, and has excellent mechanical strength (e.g., tensile strength, tear strength, elongation, and the like) when, e.g., used as a dielectric layer in a transducer. Other applications are also provided. The composition comprises: (A1, A2) a combination of chain organopolysiloxanes having an alkenyl group only on an end of a molecular chain, and a degree of polymerization within a range of 50 to 550 and a range of 600 to 1000; (B) hydrophobically treated reinforcing silica; (C) a siloxane resin containing an alkenyl group; (D) an organohydrogenpolysiloxane; and (E) a catalyst. The mass ratio of components (A1)/(A2) is within a range of 0.45 to 1.30, and the sum of component (B) and component (C) is within a range of 10 to 25 mass % of the entire composition.

Microphones, microphone systems, and methods for capturing and processing sound are described. The microphones and microphone systems may adaptively change the direction from which sound is captured. The microphones and microphone systems avoid the need to provide arrays of microphones, while providing adaptive beamforming without a time delay between each channel of information, and multi-directional sound capture. A dependency between the frequency response and system size is also avoided.

A vibration sensor and a microphone are provided. The vibration sensor includes a piezoelectric system and a capacitive system. The piezoelectric system includes a vibration component and a piezoelectric sensing component collecting a first electrical signal generated due to deformation of the vibration component. The capacitive system uses the vibration component in the piezoelectric system as a movable capacitive plate and a fixed substrate opposite to the vibration component to form a capacitive vibration sensor. The deformation of the vibration component changes a distance between the vibration component and the fixed substrate. A capacitive sensing component collects a second electrical signal generated due to the distance change. The capacitive sensing component is disposed in a region where the first electrical signal in the piezoelectric system is low, thereby better using space of the vibration sensor, and enhancing the second electrical signal without affecting output of the first electrical signal.

A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern having first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region. The via pattern further includes second lines extending from the anchored region of the membrane toward the central region of the membrane. Each of the second lines includes a length less than a length of each of the first lines.

A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

There is disclosed a transducer and a method for generating the transducer. The transducer is formed on a substrate layer. The transducer includes a first electrode layer, a first piezoelectric layer on the first electrode layer, and a second electrode layer on the first piezoelectric layer. The first electrode layer is connected to a first electrical connector and the second electrode layer is connected to a second electrical connector. The transducer can be configured to act as an acoustic sensor or an electric potential sensor.

Provided is a piezoelectric element, of which thickness can be thin and uniform, and in which winding failure hardly occurs during manufacturing and deformation of the thin film electrode is unlikely to occur.

A piezoelectric element includes a piezoelectric layer, electrode layers formed on both sides of the piezoelectric layer, and a protective layer laminated on a surface of the electrode layer opposite to a surface on the piezoelectric layer side, in which the electrode layer has an exposed portion where the piezoelectric layer is not formed at least at a part of an end portion, and the piezoelectric layer has a gradually decreasing portion of which thickness gradually decreases toward the exposed portion in the end portion adjacent to the exposed portion.

A transducer of the preferred embodiment including a transducer and a plurality of adjacent, tapered cantilevered beams. Each of the beams define a beam base, a beam tip, and a beam body disposed between the beam base and the beam tip. The beams are arranged such that each of the beam tips extends toward a common area. Each beam is joined to the substrate along the beam base and is free from the substrate along the beam body. A preferred method of manufacturing a transducer can include: depositing alternating layers of piezoelectric and electrode onto the substrate in block, processing the deposited layers to define cantilever geometry in block, depositing metal traces in block, and releasing the cantilevered beams from the substrate in block.

A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate and a membrane over the substrate. The membrane includes a piezoelectric material configured to generate charges in response to an acoustic wave. The membrane includes a via pattern having first lines that partition the membrane into slices such that the slices are separated from each other at a first region near an edge of the membrane and connected to each other at a second region.