A mount, mount assembly, and speaker mount. That includes: a mount body with flange; a tower assembly including: a trigger, a dog; a bias member biasing the dog towards the mount body; a path guide guiding the dog along the tower assembly. The path guide allows/forces the dog to be oriented according to: a first orientation wherein the foot is pointed directly towards the mount body and substantially aligned with the tower assembly, and a second orientation wherein the foot is not so pointed and aligned such that the toot does interfere with travel of the mount through an aperture when the dog is in a second position that is spaced closer to the mount body than the first position. The dog changes between positions by operation of the bias member and not by a screw.

An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm. One technical problem to be solved by the embodiment of the present invention is to ensure, by using the injection molding inserts, the stability of relative distance and parallelism of the diaphragm connection surface of the housing with respect to both the front sound cavity support surface and the rear sound cavity support surface, so as to ensure stability of the acoustic performance of the speaker.

An audio speaker cover with a central region and a peripheral region. The central region has a surface that faces an observer and a speaker cover body below the surface. The audio speaker cover body defines a plurality of apertures with lands between the apertures. The apertures have cylindrical walls that meet the surface orthogonally. Precisely engineered apertures permit minimal sound transmission loss and allow a high aperture density without sacrificing the ability of intervening lands in the audio speaker cover to protect an underlying speaker.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

A loudspeaker assembly includes an enclosure having an open front side and a wall having an interior surface and an exterior surface with a wall thickness defined therebetween. The wall is integrally molded with a screw boss supported by a plurality of molded ribs that extend inwardly from the interior surface. The loudspeaker assembly also includes an audio transducer positioned within the enclosure and having an output side facing the open front side of the enclosure to emit sound therefrom; and a mount for securing the transducer to the enclosure via a screw threaded into the screw boss. At a meeting point with the interior surface, each of the plurality of molded ribs has a rib thickness measured perpendicular to the wall thickness, the rib thickness being less than 50 percent of the wall thickness to avoid sink marks in the injection molded part.

A manufacturing process for a grille element of a media playback system is provided. In one embodiment a sheet of plastic is thermoformed into a desired shape. Holes may have been drilled into the sheet of plastic prior to being thermoformed. Once thermoformed into the desired shape, a coating is applied and cured via a subsequent heat treatment process that anneals the material to remove additional stresses in the material from thermoforming. Once formed and heat treated, the formed component can be bonded to profile substrates to help maintain the formed desired shape.

The invention relates to speaker systems for high-quality sound reproduction. It provides a simplified structure of the device, improves the device manufacturability and durability. The speaker system includes the driver, the horn for reproducing low-frequency range sound (rear horn), and the horn for reproducing high-frequency and mid-frequency range sound (front horn); both horns are made in the form of a single enclosure with the capability of mounting the driver in this enclosure, while the enclosure is made of two solid parts symmetrical with respect to the plane of the central vertical section, each part represents a half of the overall profile of the front and rear horns, with no joints at the junction between the front and the rear horns.

A metallic audio speaker cover and a related method of manufacturing that has a surface with a cloth-like appearance. The metallic audio speaker cover has a base of expanded metal through which sound may pass; a pretreatment film which adheres to the expanded metal base; and one or more multi-color powder coating films that adhere to the pretreatment film. In some embodiments, the surface also has anti-microbial properties.

In an embodiment a lid includes a top section and a side section below the top section, wherein a vertical height of the top section is I.sub.TS*H.sub.B, I.sub.TS being a first multiple integer and H.sub.B being a basic height, and wherein a vertical height of the side section is I.sub.SS*H.sub.B, I.sub.SS being a second multiple integer and H.sub.B being the basic height H.sub.B.