A metal heater system. More specifically, a plurality of metal heaters is coupled to the surface of the lower end of a pipeline at predetermined intervals in the longitudinal direction of the pipeline, and PTC heating elements inside the metal heaters conduct heat to local portions of the pipeline. Convection is generated in a fluid inside the pipeline because of the heat conducted to the local portions, and thus the overall pipeline is maintained at a constant temperature, efficiently preventing the freezing and bursting of the pipeline in winter.

A mounting rail is provided that includes a DIN rail and one or more heating cable channels. A channel defined by the DIN rail may include one of the heating cable channels. Heating cables may be installed in the heating cable channels using adhesive and/or heat transfer material to form an electronics heating module. The heating cables may be self-regulating heating cables. The mounting rail may include multiple heat transfer fins that transfer heat generated by the heating cables to environment surrounding the mounting rail. A terminal block may be mounted on the DIN rail and may supply electric power to the heating cables.

The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.

The present disclosure provides a heater and a heating base. The heater is used in a semiconductor process apparatus and includes a heating body and a base configured to support the heating body. The base includes a base body and a plate connected to each other. The base body is opposite to the heating body and arranged at an interval. The plate is arranged between the base body and the heating body and is fixedly connected to the heating body. An elastic bending structure is arranged on at least one of the plate, the base body, or the connection place between the plate and the base body. The elastic bending structure is configured to cause the plate and the heating body to remain connected by generating elastic deformation when the plate and the base body expand and deform.

A heating element unit for an electric resistance heater comprises: a casing; a heating element within the casing; an electrical supply pin in electrical contact with the heating element; an electrically insulating filler between the heating element and the casing; and an electrically insulating barrier provided between portions of the heating element, the electrical supply pin and/or the casing. The electrically insulating barrier has a greater dielectric strength than the electrically insulating filler, and the dielectric strength of the electrically insulating barrier is greater than about 1500 kV/m (greater than about 40 V/mil).

A heating element unit for an electric resistance heater comprises: a casing; a heating element within the casing; an electrical supply pin in electrical contact with the heating element; an electrically insulating filler between the heating element and the casing; and an electrically insulating barrier provided between portions of the heating element, the electrical supply pin and/or the casing. The electrically insulating barrier has a greater dielectric strength than the electrically insulating filler, and the dielectric strength of the electrically insulating barrier is greater than about 1500 kV/m (greater than about 40 V/mil).

A three-dimensional heating atomization device includes a shell, a heating element, a first thermo-electrode lead and a second thermo-electrode lead, wherein a heating chamber is arranged in the shell, one end of the first thermo-electrode lead is connected with one end of the heating element, and one end of the second thermo-electrode lead is connected with the other end of the heating element, so that a bottom surface and a side surface of the heating chamber are both heated by one heating member, and three-dimensional heating is more uniform and efficient, thus being beneficial for improving an atomization effect. Moreover, the first thermo-electrode lead and the second thermo-electrode lead not only can be used for supplying electric energy to the heating element to heat the heating chamber, but also can form a thermocouple by using the first thermo-electrode lead and the second thermo-electrode lead, so that a temperature of the heating element is detected by the thermocouple to realize a temperature control function of the heating element, thus avoiding use of a temperature measurement accessory such as a temperature sensor, simplifying an internal structure of an atomizer product, reducing accessories needed by the whole product, and allowing assembly and use to be more convenient and efficient.

A three-dimensional heating atomization device includes a shell, a heating element, a first thermo-electrode lead and a second thermo-electrode lead, wherein a heating chamber is arranged in the shell, one end of the first thermo-electrode lead is connected with one end of the heating element, and one end of the second thermo-electrode lead is connected with the other end of the heating element, so that a bottom surface and a side surface of the heating chamber are both heated by one heating member, and three-dimensional heating is more uniform and efficient, thus being beneficial for improving an atomization effect. Moreover, the first thermo-electrode lead and the second thermo-electrode lead not only can be used for supplying electric energy to the heating element to heat the heating chamber, but also can form a thermocouple by using the first thermo-electrode lead and the second thermo-electrode lead, so that a temperature of the heating element is detected by the thermocouple to realize a temperature control function of the heating element, thus avoiding use of a temperature measurement accessory such as a temperature sensor, simplifying an internal structure of an atomizer product, reducing accessories needed by the whole product, and allowing assembly and use to be more convenient and efficient.

The present invention relates to a heating paint which can be used to generate a surface heating device on a wall. The invention further relates to a surface heating device which is suitable in particular for heating a room, and also to a kit for producing a surface heating device on a wall. The invention relates, moreover, to uses of the subjects of the invention, especially for producing a surface heating device and, respectively, for heating a room, and to corresponding methods.

The present invention relates to a heating paint which can be used to generate a surface heating device on a wall. The invention further relates to a surface heating device which is suitable in particular for heating a room, and also to a kit for producing a surface heating device on a wall. The invention relates, moreover, to uses of the subjects of the invention, especially for producing a surface heating device and, respectively, for heating a room, and to corresponding methods.