In one embodiment, the electronic vaping device includes a cartridge and a battery section. The cartridge and the battery section are connectable so as to define an air inlet between a portion of the cartridge and a portion of the battery section.

In one embodiment, the electronic vaping device includes a cartridge and a battery section. The cartridge and the battery section are connectable so as to define an air inlet between a portion of the cartridge and a portion of the battery section.

A system such as a vehicle may have windows with one or more conductive layers. The conductive layers may form part of an infrared-light-blocking layer or other layer. The infrared-light-blocking layer or other layer may be formed as a coating on a transparent structural window layer such as an outer or inner glass layer in a laminated window or may be embedded in a polymer layer between the outer and inner layers. Segmented terminals and elongated terminals that may extend past two or more segmented terminals may be coupled to the edges of the conductive layers. Using these terminals, control circuitry can apply localized ohmic heating currents and can make resistance measurements on the conductive layers to detect cracks.

A system such as a vehicle may have windows with one or more conductive layers. The conductive layers may form part of an infrared-light-blocking layer or other layer. The infrared-light-blocking layer or other layer may be formed as a coating on a transparent structural window layer such as an outer or inner glass layer in a laminated window or may be embedded in a polymer layer between the outer and inner layers. Segmented terminals and elongated terminals that may extend past two or more segmented terminals may be coupled to the edges of the conductive layers. Using these terminals, control circuitry can apply localized ohmic heating currents and can make resistance measurements on the conductive layers to detect cracks.

Provided is a heater substrate that includes an insulating substrate having a first surface and a second surface that is on an opposite side from the first surface, a heater wire located inside the insulating substrate, and an adjustment part that is electrically connected to the heater wire. The adjustment part includes a pair of adjustment terminals that are located on the second surface and are respectively electrically connected to two ends of a partial section of the heater wire, and an adjustment conductor that is located on the second surface and is connected to the pair of adjustment terminals. Also provided are a probe card substrate and a probe card that include the heater substrate.

A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.

A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C of the cured product layer is in a range from 5.0×10.sup.6 Pa to 1.0×10.sup.10 Pa.

A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C of the cured product layer is in a range from 5.0×10.sup.6 Pa to 1.0×10.sup.10 Pa.

A ceramic heater includes a ceramic plate having a wafer mounting surface and having a resistive heating element embedded in the plate; and a ceramic tubular shaft having a tubular shape and bonded to a back surface of the plate. The plate has a circular recess with a bottom in the back surface thereof. The tubular shaft has a plate-side flange extending radially outward from an outer peripheral surface of a plate-side end portion. An entire end surface of the plate-side end portion of the tubular shaft is bonded to a bonding region of the back surface of the plate outside the circular recess. The opening diameter d1 of the plate-side end portion of the tubular shaft, the inner diameter d2 of the plate-side flange of the tubular shaft, and the diameter D1 of the circular recess of the plate satisfy d2≥d1≥D1.

The present disclosure discloses a transmission electron microscope in-situ chip and a preparation method thereof. The transmission electron microscope in-situ chip includes a transmission electron microscope high-resolution in-situ gas phase heating chip, a transmission electron microscope high-resolution in-situ liquid phase heating chip and a transmission electron microscope in-situ electrothermal coupling chip. The transmission electron microscope high-resolution in-situ gas phase heating chip and the transmission electron microscope high-resolution in-situ liquid phase heating chip are respectively suitable for gas samples and liquid samples, and the transmission electron microscope in-situ electrothermal coupling chip realizes the multi-functional embodiment of electrothermal coupling. The three transmission electron microscope in-situ chips have the advantages of high resolution and low sample drift rate.