A dielectric heating device is provided with two or more electrodes, a grounded surface connected to a first electrode, a signal source connected to a second electrode to output a high-frequency signal, a first element interposed serially between the signal source and second electrode, and a second element interposed serially between the grounded surface and first electrode. The first element includes two terminals that electrically connect the signal source and second electrode in a non-contact manner, to cause the high-frequency signal outputted from the signal source to pass through the first element, by using the electric coupling between the two terminals. The second element includes two terminals that electrically connect the grounded surface and first electrode in a non-contact manner, to output, by using the electric coupling between the two terminals, the high-frequency signal outputted from the signal source, to the grounded surface.

A dielectric heating device is provided with two or more electrodes, a grounded surface connected to a first electrode, a signal source connected to a second electrode to output a high-frequency signal, a first element interposed serially between the signal source and second electrode, and a second element interposed serially between the grounded surface and first electrode. The first element includes two terminals that electrically connect the signal source and second electrode in a non-contact manner, to cause the high-frequency signal outputted from the signal source to pass through the first element, by using the electric coupling between the two terminals. The second element includes two terminals that electrically connect the grounded surface and first electrode in a non-contact manner, to output, by using the electric coupling between the two terminals, the high-frequency signal outputted from the signal source, to the grounded surface.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.

An example embodiment relates to a radiofrequency (RF) power amplifier pallet, and further relates to an electronic device that includes such a pallet. The RF power amplifier pallet may include a coupled line coupler that includes a first line segment and a second line segment that is electromagnetically coupled to the first line segment. A first end of the first line segment may be electrically connected to an output of an RF amplifying unit. The RF power amplifier pallet may further include a dielectric filled waveguide having an end section of the first dielectric substrate, an end section of the second dielectric substrate, and a plurality of metal wall segments covering the end sections of the first and second dielectric layers. The plurality of metal wall segments may be arranged spaced apart from the first line segment and electrically connected to a first end of the second line segment.

An example embodiment relates to a radiofrequency (RF) power amplifier pallet, and further relates to an electronic device that includes such a pallet. The RF power amplifier pallet may include a coupled line coupler that includes a first line segment and a second line segment that is electromagnetically coupled to the first line segment. A first end of the first line segment may be electrically connected to an output of an RF amplifying unit. The RF power amplifier pallet may further include a dielectric filled waveguide having an end section of the first dielectric substrate, an end section of the second dielectric substrate, and a plurality of metal wall segments covering the end sections of the first and second dielectric layers. The plurality of metal wall segments may be arranged spaced apart from the first line segment and electrically connected to a first end of the second line segment.

A high-frequency dielectric heating device includes a high-frequency power source generating a high-frequency voltage, a first resonance circuit electrically coupled to the high-frequency power source and outputting a first resonance voltage based on the high-frequency voltage, and an antenna having a capacitor including a first electrode and a second electrode and a coil, electrically coupled to the first resonance circuit, and supplied with the first resonance voltage, wherein one end of the coil is electrically coupled to the first electrode and the other end is electrically series-coupled to the first resonance circuit, the first resonance circuit includes a capacitor having fixed capacitance, a resonance frequency of the first resonance circuit is different from a resonance frequency of the antenna, a frequency range in which a return loss of the first resonance circuit is equal to or less than 0.1 dB and a frequency range in which a return loss of the antenna is equal to or less than 0.1 dB overlap, and a frequency of the high-frequency voltage is in the frequency range in which the return loss of the first resonance circuit is equal to or less than 0.1 dB.

Heating systems utilizing radio frequency (RF) energy and methods for using the same to rapidly and uniformly heat packaged articles moving through the system on one or more convey lines. These systems may be useful for a variety of processes, including the pasteurization or sterilization of packaged foodstuffs.