A fast annealing equipment is applicable to the annealing treatment of silicon carbide wafers. The fast annealing equipment comprises a variable frequency microwave power source system, a resonant chamber heating system and a measurement and control system. The variable frequency microwave power source system uses a solid state power amplifier and has the flexibility of fast frequency sweep during heat treatment to compensate for resonant frequency changes due to load effect caused by temperature changes in a material to be annealed. In order to improve an energy efficiency and provide a sufficient microwave energy uniform area, the TM.sub.010 resonant chamber structure can be used to anneal 4-inch to 8-inch silicon carbide wafers. The measurement and control system combines software and hardware to form an automatic system with instant feedback to provide further flexibility, stability and reliability for the entire equipment.

A fast annealing equipment is applicable to the annealing treatment of silicon carbide wafers. The fast annealing equipment comprises a variable frequency microwave power source system, a resonant chamber heating system and a measurement and control system. The variable frequency microwave power source system uses a solid state power amplifier and has the flexibility of fast frequency sweep during heat treatment to compensate for resonant frequency changes due to load effect caused by temperature changes in a material to be annealed. In order to improve an energy efficiency and provide a sufficient microwave energy uniform area, the TM.sub.010 resonant chamber structure can be used to anneal 4-inch to 8-inch silicon carbide wafers. The measurement and control system combines software and hardware to form an automatic system with instant feedback to provide further flexibility, stability and reliability for the entire equipment.

A microwave heating sheet includes a substrate and a heating layer disposed on a first surface of the substrate. The heating layer includes a polar solvent that has a boiling point of not less than 100° C. and a polyelectrolyte that is dissolved in the polar solvent.

A process and apparatus for heating a microwave transparent material or di-polar material. The apparatus includes a vessel that has susceptor material on at least a portion of the vessel walls. Microwaves are generated by a microwave transmitter and introduced into the vessel which can heat both microwave transparent materials and di-polar materials within the vessel.

A process and apparatus for heating a microwave transparent material or di-polar material. The apparatus includes a vessel that has susceptor material on at least a portion of the vessel walls. Microwaves are generated by a microwave transmitter and introduced into the vessel which can heat both microwave transparent materials and di-polar materials within the vessel.

A wafer processing apparatus includes a pressure applying element, a rotatable element, a control element, and a heat source. The pressure applying element includes a first pressure applying head having a first working surface and a second pressure applying head having a second working surface. The rotatable element and the pressure applying element are connected. The control element is electrically connected to the rotatable element. The heat source is disposed beside the pressure applying element.

A wafer processing apparatus includes a pressure applying element, a rotatable element, a control element, and a heat source. The pressure applying element includes a first pressure applying head having a first working surface and a second pressure applying head having a second working surface. The rotatable element and the pressure applying element are connected. The control element is electrically connected to the rotatable element. The heat source is disposed beside the pressure applying element.

An apparatus for heating a fluid is provided, the apparatus comprising a chamber and one or more tubes for conveying the fluid through the chamber, wherein at least one of the tubes has a bend and the bend comprises a removable bend cap including at least one microwave emitter. In another aspect, there is provided an apparatus for removably attaching a bend in tubing for conveying a fluid through the enclosure, the bend having a removable bend cap, and the apparatus comprising a sleeve extending through an opening in the enclosure, wherein the sleeve is adapted to receive the removable bend cap. In yet another aspect, there is provided an apparatus having an enclosure and tubing within the enclosure, the tubing being to convey fluid through the enclosure. At least one of the tubes has a bend, and the bend comprises a removable bend cap which comprises a cleaning device.

An apparatus for heating a fluid is provided, the apparatus comprising a chamber and one or more tubes for conveying the fluid through the chamber, wherein at least one of the tubes has a bend and the bend comprises a removable bend cap including at least one microwave emitter. In another aspect, there is provided an apparatus for removably attaching a bend in tubing for conveying a fluid through the enclosure, the bend having a removable bend cap, and the apparatus comprising a sleeve extending through an opening in the enclosure, wherein the sleeve is adapted to receive the removable bend cap. In yet another aspect, there is provided an apparatus having an enclosure and tubing within the enclosure, the tubing being to convey fluid through the enclosure. At least one of the tubes has a bend, and the bend comprises a removable bend cap which comprises a cleaning device.

A microwave appliance, as provided herein, may include a cabinet, a magnetron, and a drawer liner. The cabinet may define a primary cooking chamber. The magnetron may be mounted within the cabinet in communication with the primary cooking chamber to direct a microwave thereto. The drawer liner may have a side wall joined to a base wall. The drawer liner may be slidably mounted to the cabinet to move along the vertical direction between a contracted position and an expanded position. The side wall may be received within the cabinet in the contracted position. The side wall may define a secondary cooking chamber with the base wall below the primary cooking chamber in the expanded position.