The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

A layer of the mixture that contains polymer and conductive particles is applied over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity.

The invention is a magnetically adhered, static dissipative floor covering, comprising a magnetically receptive floor surface; and a floor covering comprising a plurality of static dissipative, magnetic floor tiles, wherein the tiles are held in place by magnetic interaction between the tiles and the magnetically receptive surface.

A method of adding a grounding point to a preexisting dissipative coating layer includes the consequent steps of: placing an electrically conductive insert into a preexisting dissipative coating layer; placing an electrically conductive layer on the preexisting dissipative coating layer in proximity of the conductive insert; fastening the electrically conductive layer to the electrically conductive insert; connecting the electrically conductive layer and/or the electrically conductive insert to an equipotential bonding. The method is for a safe and fast installation of additional grounding points for a preexisting dissipative coating or system without removing the preexisting dissipative coating or system.