A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.

A power terminal includes first and second conductive sheets. The first conductive sheet includes a first joining portion, first fingers extending from the first joining portion, and a first mounting portion extending from the first joining portion and configured to mount to a substrate. The first fingers have hooked ends connected to the first joining portion by first beams. The second conductive sheet includes a second joining portion, second fingers extending from the second joining portion, and a second mounting portion extending from the second joining portion and configured to mount to the substrate. The two second fingers have curved ends connected to the second joining portion by second beams. The hooked ends and the curved ends include contact surfaces configured to contact a same side of a card. At least one of the first and second mounting portions includes at least two mounting tails.

A semiconductor assembly includes a semiconductor module designed for connection to a heat sink and having a surface which faces away from the heat sink and has a depression, a printed circuit board, and an electronic circuit arranged on the printed circuit board. The printed circuit board together with the electronic circuit is secured to the semiconductor module on the surface of the semiconductor module. The electronic circuit includes electronic components configured to protrude into the depression of the semiconductor module.

A two part connector for the temporary connection of an external periphery device to a printed circuit board (PCB). When coding or diagnostics need to be performed on much of todays electronic or electronic controlled equipment, an external unit needs to be physically connected to the microprocessor on the PCB of the equipment. Until now equipment manufacturers either install a socket onto the PCB, or form a mating part of connector directly on the surface of PCB, that is electronically connected to the microprocessor through electrical trace paths. This device eliminates the need for a socket and forms an intermediary element between the external unit and the PCB, that connects to the PCB with a set of vertical pins that matingly connect to a series of cutouts on the PCB. This device connects to a plethora of external devices and takes zero space on the surface of the PCB.

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

The present disclosure disclosed a link loopback device comprising a substrate and a flexible circuit board. The substrate comprises an interface connecting end, a transmitting end, and a receiving end. The interface connecting end is electrically connected to the transmitting end and the receiving end. The flexible circuit board comprises a first electrical connecting end and a second electrical connecting end. The first electrical connecting end of the flexible circuit board is electrically connected to the transmitting end of the substrate, and the second electrical connecting end of the flexible circuit board is electrically connected to the receiving end of the substrate, forming a link between the flexible circuit board and the substrate. Just like testing with a direct attach cable (DAC), the link loopback device of the present disclosure can simulate a complete actual link to improve the accuracy of the test effectively.

A flexible circuit board with improved bending reliability and a manufacturing method thereof are disclosed, the flexible circuit board comprising: a first dielectric formed to be elongated in a horizontal direction; a second dielectric positioned above the first dielectric; a third dielectric spaced apart from the second dielectric in the horizontal direction and positioned above the first dielectric; a first cover layer positioned on the first dielectric and covering an upper portion of the first dielectric between the second dielectric and the third dielectric; a first bonding sheet positioned between the first dielectric and the second dielectric and covering an upper portion of one end of the first cover layer; and a second bonding sheet positioned between the first dielectric and the third dielectric and covering an upper portion of the other end of the first cover layer.

A hybrid edge connector includes an insulative housing with a slot lined with signal terminals, in a signal portion, and power terminals in a power portion. The power terminals may be made with multiple layers, with each layer formed into one or more fingers. Each finger may be configured to make contact with an edge of a card inserted in the slot such that each terminal has multiple contact points to the card and can carry a large current. To support a large current, the card may be a hybrid card, with a signal portion formed using a conventional PCB manufacturing techniques and a power portion formed with one or more blades mechanically coupled to the signal portion. The slot in the connector housing may have different widths in the signal and power portions and the center lines of those portions may be offset with respect to each other.

An electrical junction box including: bus bars; a circuit board of which one side opposes the bus bars; a conductive portion that is provided on the one side of the circuit board, and is exposed from the other side of the circuit board; an opening that is provided in parallel with the conductive portion in the circuit board, and from which a portion of the bus bars is exposed; a switching element that is arranged on the other side of the circuit board, and of which an input terminal or an output terminal is connected to the conductive portion; and a conductive piece that is arranged straddling a portion of the bus bars and the conductive portion.

A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.