Described herein is a component carrier, wherein the component carrier comprises a stack comprising a plurality of electrically conductive layer structures and at least one electrically insulating layer structure, wherein a first of said electrically conductive layer structures comprises a first surface where a first plurality of conductive nanowires is connected and a second of said electrically conductive layer structures comprises a second surface where a second plurality of conductive nanowires is connected, wherein said first and second surfaces and said first and second pluralities of nanowires are configured to at least partially connect the nanowires of the first plurality of nanowires with the respective nanowires of the second plurality of nanowires.

A power semiconductor module arrangement includes: a housing; a substrate having a substrate layer and a first metallization layer on a first side of the substrate layer, inside the housing or forming a bottom of the housing; a printed circuit board inside the housing, vertically above and in parallel to the substrate; electrically conducting components on the printed circuit board and substrate; an encapsulant at least partly filling the interior of the housing; and a magnetic field sensor either on the substrate within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the printed circuit board, or on the printed circuit board within range of a magnetic field caused by a current flowing through one of the electrically conducting components arranged on the substrate. The magnetic field sensor is electrically insulated from the respective electrically conducting component.

A circuit system includes an integrated circuit package mounted on a first side of a printed circuit board and a power regulator connected to power terminals of the integrated circuit package through a cutout in the printed circuit board. The power regulator draws power from the printed circuit board by way of side pins around a periphery of the cutout.

An electronic device includes: a system board; a load, located on the first side of the system board and including a power supply region, the power supply region includes load pins arranged in a plurality of rows and in a plurality of columns; and at least one column of output capacitors, located on the second side of the system board along a third direction; at least one row of the load pins is a first arrangement row, the first arrangement row includes a plurality of load pin groups arranged sequentially along the second direction, each of the load pin groups includes at least two load pins of a same polarity; and two ends of a vertical projection of each column of the output capacitors on the power supply region are located at two sides of a centerline, in the third direction, of at least one first position pin.

The disclosure provides a sensor case, a sensor system, and a vehicle, the sensor case including: a backing plate; a first base plate mounted to the backing plate, the first base plate having a first opening configured for the first sensor to pass through; and a protecting component magnetically coupled to the backing plate, the protecting component including a first cover plate positioned above the first base plate and a first gap being defined between the first cover plate and the first base plate. The sensor case of the disclosure can provide waterproof and rainproof functions of a sensor, and has a simple structure, stable performance, convenient opening and closing, and improved cleaning efficiency of the sensor.

A printed circuit board of an information handling system includes a pair of signal vias including a pair of keepout objects. Each one of the keepout objects surrounds one of the signal vias. The printed circuit board includes a pair of signal traces that includes a positive signal trace and a negative signal trace, wherein the pair of signal traces are between the keepout objects, and wherein a width of each of the signal traces is increased.

A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.

An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member. The control circuit may be configured to, when the first electrically conductive pad is shorted to the second electrically conductive pad, cause the at least one electrical component to be electrically coupled to the battery and when the first electrically conductive pad is electrically isolated from the second electrically conductive pad, cause the at least one electrical component to be electrically decoupled from the battery.

An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.