An electronic device may include a printed circuit with a surface-mounted component. The component may produce resistive heating within the printed circuit. Resistive thermal devices (RTDs) may be embedded within the printed circuit. An RTD may at least partially overlap the electrical component. The RTD may include contact pads on a flexible substrate and a meandering conductive trace between the contact pads. The trace may have a resistance varying linearly as a function of temperature. A data acquisition system (DAQ) may measure the resistance of the RTD. Control circuitry may identify the temperature of the printed circuit based on the resistance of the RTD measured by the DAQ and may reduce power consumption by the component when the temperature exceeds a threshold. This may serve to prevent overheating in the printed circuit over time, thereby maximizing the operating life of the printed circuit.

A method includes attaching an integrated circuit chip module substrate to a printed circuit board (PCB). First region(s) of a bottom surface of the module include electrical contacts to the board, and second region(s) of the bottom surface of the module lack such contacts. Mechanical structures are assembled into the second regions. These structures allow lateral motion of the module relative to the board, and are sized and placed to inhibit bending of the second regions of the module towards the board under application of a vertical force on a top surface of the module. A package for an integrated circuit may be assembled using the method.

A portable electronic device and an image-capturing module thereof are provided. The image-capturing module includes a circuit substrate, an image sensing chip, a rigidity reinforcing structure, and a lens assembly. The circuit substrate has a plurality of conductive substrate contacts. The image sensing chip is disposed on the circuit substrate and electrically connected to the circuit substrate. The image sensing chip includes an image sensing region, and a plurality of conductive chip contacts respectively and electrically connected to the conductive substrate contacts. The rigidity reinforcing structure is disposed on the circuit substrate. The lens assembly includes a lens holder and a lens structure disposed on the lens holder, and the lens structure corresponds to the image sensing region. A perpendicular projection of each of the conductive substrate contacts and a perpendicular projection of each of the conductive chip contacts can be shown on the rigidity reinforcing structure.

An electronic module is provided, including a circuit board, at least one electronic component, a covering layer, and an adhesive. The at least one electronic component is disposed on the circuit board. The covering layer has multiple holes, and the covering layer is disposed on the circuit board and covers the at least one electronic component. The adhesive is combined to the covering layer, and the adhesive fills the holes and encapsulates the at least one electronic component.

An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

Various embodiments described herein provide for printed circuit boards with one or more spaces for embedding components, which can be used to implement a memory sub-system.

A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.

The present application relates to the technical field of circuit board fabricating, and provides a method for fabricating an asymmetric board, the method includes fabricating a master board, fabricating a second sub-board, thermal compression bonding the master board and the second sub-board, and milling a finished board; further includes at least one of the following three steps: laying copper on the connection positions of the master board except for the second copper layer of an outermost layer to obtain laying copper area, digging copper on the connection positions of the third copper layer, and after the step of milling the finished board, on each of the impositions, performing depth control milling at the connection positions from a side of the second sub-board on each imposition to obtain a depth control groove.

A strain relief plug to restrict movement of wires on a printed circuit board, the strain relief plug having an elongated stem along a vertical axis of the strain relief plug. The strain relief plug has an in-board flange defined by the elongated stem, the in-board flange configured to seat in a bore defined by the printed circuit board. The strain relief plug has an anchor defined by a first end of the elongated stem configured to prevent the strain relief plug from releasing from the printed circuit board. The strain relief plug has a bar defined by a second end of the elongated stem and transverse the vertical axis, the bar forming wire channels. The strain relief plug provides strain relief for wires on the printed circuit board of an electric motor in a vertical dimension resembling the thickness of the printed circuit board.

This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.