The present application provides an asymmetric board, which includes the first master board, the second master board, and the insulating dielectric layer sandwiched between the first master board and the second master board, and the depth control grooves are disposed in the connection position between the units on the asymmetric board, and located on the surface of the second master board and extending a toward the side of the first master board, the depth control grooves provide space for the expansion of the second master board, reduce the stress of the units, and reduce the warping of the second master board. When the number of the depth control grooves in the first direction and/or the second direction is greater than 0, the depths of the depth control grooves increase by X from a center to an edge of the asymmetric board, and the X is greater than or equal to 0.

A semiconductor device, a circuit board structure and a manufacturing forming thereof are provided. A circuit board structure includes a core layer, a first build-up layer and a second build-up layer. The first build-up layer and the second build-up layer are disposed on opposite sides of the core layer. The circuit board structure has a plurality of stress releasing trenches extending into the first build-up layer and the second build-up layer.

A wiring board includes a first interconnect structure including a first interconnect layer, and a first insulating layer including a non-photosensitive thermosetting resin as a main component thereof, a second interconnect structure including second interconnect layers, and second insulating layers including a photosensitive resin as a main component thereof, and laminated on the first interconnect structure, and an encapsulating resin layer including a non-photosensitive thermosetting resin as a main component thereof, and laminated on an uppermost second insulating layer. An uppermost second interconnect layer includes a pad protruding from the uppermost second insulating layer. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad. Thermal expansion coefficients of the first insulating layer and the encapsulating resin layer are lower than that of the second insulating layers.

A motherboard with shockproof, shakeproof and waterproof functions is installed in a cabinet of an electronic device, the motherboard includes a PCB board, wherein front surface of the PCB board is provided with a plurality of structural members, a camera seat unit, an audio seat unit, a functional seat unit, a holder seat and a battery seat with shockproof and shakeproof functions; wherein each of the structural members is dispersedly fixed on a side of the PCB board, wherein the structural member screws and fixes the PCB board inside the cabinet, and wherein each of the seats and the PCB board are coated with waterproof coating.

A multilayer printed circuit board includes a plurality of conductive layers formed by a conductive material, in which a blank region with the conductive material removed is formed in at least part of at least an intermediate conductive layer that is formed inside the multilayer printed circuit board, among the plurality of conductive layers, a plurality of island regions are formed by the conductive material included in the intermediate conductive layer in the blank region, and each of the plurality of island regions is not electrically connected to other regions included in the intermediate conductive layer and is disposed so as to be dispersed from one another.

A coil assembly for integration into a transducer is presented. The coil assembly may include a metal bobbin assembly, a wire coil, and one or more nonconductive printed circuit board (PCB) stiffeners. A speaker that renders micro noise in an artificial reality environment for improving simulated presence is further presented. The speaker may generate a plurality of micro noises based in part on the determined state of the virtual object. The speaker may spatialize the plurality of micro noises, such that the plurality of micro noises appears to originate from the virtual object. A speaker for speaker diaphragm motion detection using optical MEMS sensors is further presented. Optical MEMS sensors are used to optically monitor displacement of one or more portions of a speaker diaphragm. The speaker may be configured to determine that a speaker diaphragm is in rocking mode and move the speaker diaphragm out of rocking mode.

The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.

Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.

A circuit board 1 including: a substrate; an electrode pad on a surface of the substrate; and a projecting electrode on the electrode pad, wherein the electrode pad on which the projecting electrode is disposed is larger than the projecting electrode when viewed from above, and a coating layer covers at least a portion of an outer periphery of the electrode pad on which the projecting electrode is disposed.

The present invention proposes a carrier substrate (1) for electrical components (13), the carrier substrate (1) having a component side (4) and a cooling side (5) which is opposite the component side (4) and has a cooling structure (30), the carrier substrate (1) comprising a primary layer (10) which faces the component side (4) and is produced from ceramic for electrical insulation, and a secondary layer (20) which faces the cooling side (5) for stiffening the carrier substrate (1), characterized in that a metallic intermediate layer (15) is arranged between the primary layer (10) and the secondary layer (20) for heat transfer from the component side (4) to the cooling side (5), the metallic intermediate layer (15) being thicker than the primary layer (10) and/or the secondary layer (20).