An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

A printed circuit board structure is disclosed for providing reliable solderability for higher density component placement. The printed circuit board structure includes conductive points disposed on the surface of a printed circuit board which are separated by a channel disposed in the surface of the printed circuit board between the conductive points. The conductive points may be surface mount component terminal pads. The printed circuit board structure is particularly useful for overcoming component density limitations related to extremely miniaturized surface mount components known in the art.

A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.

A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.

In general, the subject matter described in this disclosure can be embodied in methods, systems, and program products for receiving an indication that a vehicle has begun accelerating from a stationary state. A computing system sets, in response to having received the indication that the vehicle has begun accelerating from the stationary state, an orientation value generated using a gyroscope to a default orientation value. The computing system repeatedly updates the orientation value generated using the gyroscope, based on changes in gyroscope orientation that occurred after the computing system set the orientation value to the default orientation value. The computing system determines that the updated orientation value satisfies criteria that indicates that the vehicle is likely to encounter or has encountered a dangerous situation. The computing system outputs a signal to cause the vehicle to employ a safety measure.

An air transport unit comprising a composite board. The composite board comprising an anode layer and a cathode layer of an electrically conducting material. The anode layer and cathode layer are separated by an insulator of an electrically insulating material. The composite board further comprising an electric component in electrical connection with the anode layer and the cathode layer. The air transport unit further comprising a carrier board, wherein the composite board and the carrier board each have a duct forming surface, which carrier board and composite board are arranged so that an air duct forms between the duct forming surfaces.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.