A flexible display apparatus is disclosed. The flexible display apparatus includes a display panel, a cover substrate, a first receiving portion and a first fluid. The display panel includes a first region and a second region surrounding at least one sides of the first region. The cover substrate is disposed over the display panel. The first receiving portion is disposed between the display panel and the cover substrate. The first receiving portion overlaps the first region of the display panel and has an empty space. The first fluid is disposed in the first receiving portion.

A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.

Disclosed are a PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) includes: a PCB board (1), a plurality of chips (11) being arranged on the PCB board (1); at least one heat sink (2), the heat sink (2) being arranged on the plurality of chips (11), and the heat sink (2) including a heat dissipation air duct (21); and an air baffle (3), the air baffle (3) being arranged adjacent to the at least one heat sink (2), the air baffle (3) being located on one side of the at least one heat sink (2), and the air baffle (3) extending along the heat dissipation air duct (21).

A printed circuit board for high-power components includes at least two dielectric layers. A thermally-conductive embedded layer is disposed between two of the dielectric layers and includes one or more internal coolant channels. Thermal vias extend from the embedded layer to an exterior surface of at least one of the dielectric layers. At least one of the dielectric layers in the printed circuit board has an exterior surface on which one or more high power components may be mounted. In some implementations, there are at least two dielectric layers on a same side of the embedded layer and high power components may be located inside the printed circuit board between two dielectric layers. Thermal resistance between the high-power components and the embedded layer is decreased in comparison to typical surface-mounted cold plates, resulting in more efficient heat dissipation. In some implementations the embedded layer is also an electrical ground plane.

Self-cooling stretchable electrical circuits with a conduit forming an electrical component and containing electrically conductive liquid are disclosed. They are formed of a platform made of a stretchable material. At least one fluid conduit is formed in the platform and the conduit is formed into an electrical component and filled with the electrically conductive liquid metal. A portion of the conduit is positioned adjacent a heat sink while a pump circulates the liquid through the conduit wherein the metal is cooled at the heat sink.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

A semiconductor component system includes a motherboard and a cooling system mounted to the motherboard. The cooling system includes sidewalls projecting from the motherboard. A sub-motherboard extends between the sidewalls and is spaced apart from the motherboard. The sidewalls and the sub-motherboard define a cooling channel over the motherboard. A connector is attached to the sub-motherboard and is configured to receive a semiconductor device daughterboard. The connector has contacts to electrically couple the semiconductor device daughterboard to the sub-motherboard.

Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

The present invention relates to a sensing device, a method of use of a sensing device and a method of manufacture of a sensing device. Embodiments are generally configured as sensor arrays for detecting a pressure change within an infusion line to pre-empt or detect line occlusions in the administration of medical infusions. Generally, embodiments comprise a support component having a support surface for mounting thereon one or more electrically connected switches, a length of expandable tubing for passing a fluid therethrough and are secured to the support surface and in physical contact with the electrically connected switches. The one or more electrically connected switches forms a sensor array adapted to sense expansion of the expandable tubing indicative of pressure changes resulting from line occlusions.

A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.