This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.

An opto-electric hybrid board connector includes an opto-electric hybrid board extending along a transmission direction of light in an optical waveguide, and a connector to which an attached region of the opto-electric hybrid board is attached. The attached region has a board front end surface for inputting and outputting light to and from the optical waveguide. The connector has a connector front end surface disposed to be flush with the board front end surface. The surface roughness SRa1 of the board front end surface is 0.2 μm or more and 3 μm or less. A difference D between the surface roughness SRa1 of the board front end surface and the surface roughness SRa2 of the connector front end surface is 1 μm or less.

The present application relates to a conductive structure body and a manufacturing method thereof. The method for manufacturing the conductive structure body according to an exemplary embodiment of the present application includes forming a metal layer on a substrate and forming a darkening layer on the metal layer, in which the forming of the darkening layer is performed by reactive sputtering using CO.sub.2.

A refrigerator and a display for a refrigerator are provided. The display may include a display plate defining an outer appearance of a front surface of the display, a plurality of display portions that displays information of the refrigerator and is formed by an arrangement of a plurality of fine through-holes that pass through the display plate, a plurality of operational interfaces formed on a front surface of the display plate and operated by a touch input, a touch PCB provided on a rear surface of the display plate and including a plurality of touch sensors at positions corresponding to the plurality of operational interfaces, a display PCB on which a LED that radiates light toward the plurality of fine through-holes is mounted, and a display cover provided close to the rear surface of the display plate and on which the touch PCB and the display PCB are mounted.

A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

The circuit board has a surface mount LED with a lens on the circuit board. A conductive portion and remaining space in the periphery of the LED are covered with solid copper foil so that reflectance of light and a heat dissipation effect are enhanced. In addition, layer structures between the circuit board and an assembled component are the same between contact portions with the assembled component so that tilt in mounting the board is suppressed. As a result, the circuit board having mounted thereon the surface mount LED having high directivity can be accurately mounted on the assembled component, tilt of an optical axis can be suppressed, the reflectance of light from the LED can be increased, and the heat dissipation effect can be enhanced.

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

A planar lightwave circuit structure based on a printed circuit board and its manufacturing method are provided. The manufacturing method includes: S1, preparing the printed circuit board; S2, adhering the lower cladding layer to one side of the printed circuit board, and then annealing process carried out; S3, jetting a lightwave circuit material on an upper surface of the lower cladding layer in a predetermined route through an electrohydrodynamic jet printing device to form lightwave circuit lines to be cured, the lightwave circuit material being a slurry containing silver ions and an ultraviolet (UV) curing agent; S4, curing the lightwave circuit lines through irradiation of UV light, the UV light irradiating onto the lightwave circuit lines through a lens assembly with slits; and S5, depositing an upper cladding layer on the lower cladding layer and the lightwave circuit lines, and then solidifying treatment carried out.