A backlight unit comprising a printed circuit board; a plurality of light sources at a surface of the printed circuit board, the plurality of light sources to emit light; and a reflective sheet, arranged above the plurality of light sources, having differing transmittance on the basis of incident angle of the light from the plurality of light sources, respectively, wherein the reflective sheet is provided with at least one gap between two adjacent light sources from among the plurality of light sources.

The disclosure provides an electronic device, including a circuit board, multiple semiconductor components, a first light reflecting structure, and a second light reflecting structure. The circuit board includes a substrate, and the substrate may have a first surface and at least one side surface. The multiple semiconductor components are disposed on the first surface. The first light reflecting structure is disposed on the first surface. The second light reflecting structure is disposed on the first surface and the at least one side surface.

An user interface device includes a lens with a top surface and a bottom surface, where the bottom surface includes at least one graphic that is visible through the top surface of the lens. The user interface device further includes a transparent circuit film with a top surface and a bottom surface, at least one light emitting diode (LED), at least one silver conductor, and a layer of transparent pressure-sensitive adhesive that secures the bottom surface of the lens to the top surface of the transparent circuit film.

In an embodiment, a package structure including an electro-optical circuit board, a fanout package disposed over the electro-optical circuit board is provided. The electro-optical circuit board includes an optical waveguide. The fanout package includes a first optical input/output portion, a second optical input/output portion and a plurality of electrical input/output terminals electrically connected to the electro-optical circuit board. The first optical input/output portion is optically coupled to the second optical input/output portion through the optical waveguide of the electro-optical circuit board.

A manufacturing method of a multilayered board, includes: a dot pattern forming process that forms a dot pattern comprising at least one hemispherical micro-lens shape by repeating a process of forming one hemispherical micro-lens shape by jetting one droplet for forming the dot pattern in an inkjet manner; and a stack pattern forming process that forms a stack pattern having a thickness less than that of the micro-lens by jetting a droplet for forming the stack pattern on a predetermined area around the dot pattern in the inkjet manner.

An opto-electric composite transmission module includes an opto-electric hybrid board, a printed wiring board, an opto-electric conversion portion, a first heat transfer member, and a case made of metal. The opto-electric hybrid board, the opto-electric conversion portion, the first heat transfer member, and a first wall of the case are disposed in order toward one side in a thickness direction. The printed wiring board integrally has a first portion and a second portion spaced apart from each other, and a connecting portion for connecting these when viewed from the top. The first portion, the second portion, and the connecting portion include a first overlapped region. The first overlapped region is overlapped with the opto-electric hybrid board without being overlapped with the opto-electric conversion portion when projected in the thickness direction. The first overlapped region is overlapped with the opto-electric conversion portion when projected in a plane direction.

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

A photonic device includes a PCB having an integrated circuit mounted thereon, with a cap mounted to the PCB and carrying a lens positioned over the integrated circuit. The cap is formed by: an outer wall mounted to the PCB, extending upwardly from the PCB, and surrounding a portion of the integrated circuit; a first retention structure extending inwardly from the outer wall and across the integrated circuit, the first retention structure having a hole defined therein; and a second retention structure having a hole defined therein, the second retention structure being affixed within the first retention structure such that the hole in the second retention structure is axially aligned with the hole in the first retention structure. The lens is mechanically constrained within the cap between the first retention structure and the second retention structure.